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MSP430F5508IRGCR

Texas Instruments

MSP430F5508IRGCR by Texas Instruments

MSP430F5508IRGCR by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 16384 ROM words. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.982

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,158 parts In-Stock

1+ parts

$2.982

100+ parts

$2.613

1k+ parts

$1.476

10k+ parts

-

35,158

$2.982

$2.613

$1.476

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,975 parts In-Stock

1+ parts

$2.833

100+ parts

-

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2,975

$2.833

-

-

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Vyrian

USA . 4,107 parts In-Stock

1+ parts

-

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4,107

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Chip Stock

USA . 3,850 parts In-Stock

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3,850

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SPM Sales

USA . 25 parts In-Stock

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-

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25

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Distributors (Availability)

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Corphita

USA . 3,219 parts In-Stock

1+ parts

$2.684

100+ parts

-

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-

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3,219

$2.684

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-

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$12.060

100+ parts

-

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638

$12.060

-

-

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Parana Technologies

USA . 1,447 parts In-Stock

1+ parts

$16.933

100+ parts

-

1k+ parts

$17.166

10k+ parts

-

1,447

$16.933

-

$17.166

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ChromeModa Solutions

Germany . 3,228 parts In-Stock

1+ parts

$19.026

100+ parts

$15.601

1k+ parts

-

10k+ parts

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3,228

$19.026

$15.601

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$19.026

100+ parts

$18.075

1k+ parts

$17.123

10k+ parts

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1,156

$19.026

$18.075

$17.123

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Lixinc

USA . 13,754 parts In-Stock

1+ parts

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13,754

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Perfect Parts

USA . 4,641 parts In-Stock

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4,641

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

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100+ parts

$17.154

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2,004

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$17.154

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Kepictronics

USA . 1,500 parts In-Stock

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1,500

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Futuretech Components

Singapore . 829 parts In-Stock

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829

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A-Z Elektronik GmbH

Germany . 300 parts In-Stock

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300

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5508IRGCR microcontroller. Designed with cutting-edge technology and quality materials, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts a variety of features, including ADC channels, DMA capabilities, and multiple timers. Experience seamless connectivity with I2C, SPI, UART, and USB interfaces, while benefiting from low power consumption and high-speed operation. Elevate your projects with the MSP430F5508IRGCR and unleash limitless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its lightweight and durable properties.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various components.

ADC Channels: YES

The presence of Analog to Digital Converters allows for seamless conversion of analog signals to digital data.

Connectivity: I2C, SPI(2), UART, USB

Multiple connectivity options enable easy integration with different devices and systems.

Speed: 25 rpm

The speed capability of 25 rpm ensures efficient processing and performance.

Technical Specifications

Microcontrollers MSP430F5508IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART, USB

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5508IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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