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MSP430F5505IRGZR

Texas Instruments

MSP430F5505IRGZR by Texas Instruments

MSP430F5505IRGZR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 4096 RAM bytes. Ideal for industrial applications, it features 18 timers, DMA channels, and peripherals like CRC and RTC for efficient system operation at temperatures ranging from -40 to 85°C.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128,745 parts In-Stock

1+ parts

$1.570

100+ parts

$1.540

1k+ parts

$1.510

10k+ parts

-

128,745

$1.570

$1.540

$1.510

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Texas Instruments

USA . 55,979 parts In-Stock

1+ parts

$2.749

100+ parts

$2.409

1k+ parts

$1.361

10k+ parts

-

55,979

$2.749

$2.409

$1.361

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 582 parts In-Stock

1+ parts

$2.612

100+ parts

-

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-

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582

$2.612

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-

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Vyrian

USA . 2,045 parts In-Stock

1+ parts

-

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-

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-

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2,045

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,405 parts In-Stock

1+ parts

$2.474

100+ parts

-

1k+ parts

-

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4,405

$2.474

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-

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AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$14.900

100+ parts

-

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798

$14.900

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Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

$49.749

100+ parts

-

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1,501

$49.749

-

-

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DigiPath Technology Company

USA . 1,260 parts In-Stock

1+ parts

$54.780

100+ parts

$50.398

1k+ parts

-

10k+ parts

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1,260

$54.780

$50.398

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ChromeModa Solutions

Germany . 3,086 parts In-Stock

1+ parts

$55.898

100+ parts

$45.836

1k+ parts

-

10k+ parts

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3,086

$55.898

$45.836

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IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$55.898

100+ parts

$53.103

1k+ parts

$50.308

10k+ parts

-

665

$55.898

$53.103

$50.308

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A-Z Elektronik GmbH

Germany . 5,472 parts In-Stock

1+ parts

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5,472

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Kepictronics

USA . 1,225 parts In-Stock

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1,225

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F5505IRGZR microcontroller - a game-changer in the world of electronics. Designed with precision and expertise, this device offers unparalleled reliability and performance. Perfect for a wide range of applications in industries such as consumer electronics, automotive, and industrial automation, this microcontroller provides unmatched value, efficiency, and versatility. Elevate your designs with the MSP430F5505IRGZR and experience the difference that quality craftsmanship and cutting-edge technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the product resilient and cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for versatile power supply options while maintaining stable performance.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex operations and calculations efficiently.

No. of Terminals: 48

Having a high number of terminals enables more connectivity options and flexibility in designing applications.

Peripherals: COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT

A wide range of peripherals allows for enhanced functionality and capabilities in various applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables faster processing speeds and responsiveness in real-time applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range and reliable performance.

Low Power Mode: YES

Enables power-efficient operation, making it ideal for applications requiring energy conservation.

Technical Specifications

Microcontrollers MSP430F5505IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5505IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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