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MSP430F5503IRGZT

Texas Instruments

MSP430F5503IRGZT by Texas Instruments

MSP430F5503IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 4096 RAM bytes, and 32768 ROM words. Ideal for industrial applications, it features peripherals like CRC, DMA(3), and UART for low power mode operation at -40 to 85 °C temperature range.

Median Price

$4.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,958 parts In-Stock

1+ parts

$3.927

100+ parts

$3.441

1k+ parts

$1.944

10k+ parts

-

33,958

$3.927

$3.441

$1.944

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DigiKey

USA . 730 parts In-Stock

1+ parts

$4.920

100+ parts

$3.132

1k+ parts

$2.886

10k+ parts

-

730

$4.920

$3.132

$2.886

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$4.920

100+ parts

$3.140

1k+ parts

$2.830

10k+ parts

-

225

$4.920

$3.140

$2.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 725 parts In-Stock

1+ parts

$3.731

100+ parts

-

1k+ parts

-

10k+ parts

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725

$3.731

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-

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Vyrian

USA . 7,990 parts In-Stock

1+ parts

-

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-

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7,990

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Chip Stock

USA . 4,700 parts In-Stock

1+ parts

-

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4,700

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,248 parts In-Stock

1+ parts

$3.340

100+ parts

-

1k+ parts

-

10k+ parts

-

11,248

$3.340

-

-

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Corphita

USA . 4,022 parts In-Stock

1+ parts

$3.534

100+ parts

-

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10k+ parts

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4,022

$3.534

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-

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Parana Technologies

USA . 1,787 parts In-Stock

1+ parts

$27.514

100+ parts

-

1k+ parts

$36.808

10k+ parts

-

1,787

$27.514

-

$36.808

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DigiPath Technology Company

USA . 263 parts In-Stock

1+ parts

$30.297

100+ parts

$27.873

1k+ parts

-

10k+ parts

-

263

$30.297

$27.873

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-

ChromeModa Solutions

Germany . 5,514 parts In-Stock

1+ parts

$30.915

100+ parts

$25.350

1k+ parts

-

10k+ parts

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5,514

$30.915

$25.350

-

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IDEA Electronic Components Group

UK . 1,317 parts In-Stock

1+ parts

$30.915

100+ parts

$29.369

1k+ parts

$27.824

10k+ parts

-

1,317

$30.915

$29.369

$27.824

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Lixinc

USA . 16,556 parts In-Stock

1+ parts

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16,556

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iodParts Technologies Inc.

India . 12,500 parts In-Stock

1+ parts

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12,500

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Component Stockers USA

USA . 206 parts In-Stock

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206

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5503IRGZT Microcontroller. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile device provides seamless connectivity and efficient processing capabilities. Experience the value and benefits of this top-of-the-line product, trusted by professionals worldwide for its quality and innovation. Elevate your projects with the Texas Instruments MSP430F5503IRGZT Microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, enabling compatibility with a wide range of power sources.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller efficient and effective.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computer) microcontroller, it offers faster execution of instructions and efficient use of resources.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speed, making this microcontroller suitable for applications requiring quick responses.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Multiple connectivity options enable seamless integration with a variety of external devices and communication protocols.

Technical Specifications

Microcontrollers MSP430F5503IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5503IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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