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MSP430F5502IRGZR

Texas Instruments

MSP430F5502IRGZR by Texas Instruments

MSP430F5502IRGZR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 4096 RAM bytes, and 24576 ROM words. Ideal for industrial applications, it features peripherals like CRC, DMA(3), and UART for efficient data processing in compact designs. With low power mode and multiple connectivity options (I2C, LIN), it offers versatile performance in embedded systems.

Median Price

$2.288

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,259 parts In-Stock

1+ parts

$1.630

100+ parts

$1.600

1k+ parts

$1.560

10k+ parts

-

2,259

$1.630

$1.600

$1.560

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Texas Instruments

USA . 9,938 parts In-Stock

1+ parts

$2.945

100+ parts

$2.581

1k+ parts

$1.458

10k+ parts

-

9,938

$2.945

$2.581

$1.458

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,229 parts In-Stock

1+ parts

$2.798

100+ parts

-

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-

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4,229

$2.798

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-

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ComSIT Distribution GmbH

Germany . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,500

-

-

-

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ComSIT USA

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

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7,500

-

-

-

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Vyrian

USA . 6,013 parts In-Stock

1+ parts

-

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-

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6,013

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,532 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

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9,532

$2.500

-

-

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Corphita

USA . 1,334 parts In-Stock

1+ parts

$2.650

100+ parts

-

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1,334

$2.650

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$10.270

100+ parts

-

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623

$10.270

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Component Stockers USA

USA . 5,130 parts In-Stock

1+ parts

$13.450

100+ parts

-

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5,130

$13.450

-

-

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Parana Technologies

USA . 572 parts In-Stock

1+ parts

$48.833

100+ parts

-

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572

$48.833

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-

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ChromeModa Solutions

Germany . 2,546 parts In-Stock

1+ parts

$54.868

100+ parts

$44.992

1k+ parts

-

10k+ parts

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2,546

$54.868

$44.992

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IDEA Electronic Components Group

UK . 2,051 parts In-Stock

1+ parts

$54.868

100+ parts

$52.125

1k+ parts

$49.381

10k+ parts

-

2,051

$54.868

$52.125

$49.381

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Perfect Parts

USA . 13,474 parts In-Stock

1+ parts

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13,474

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DigiPath Technology Company

USA . 302 parts In-Stock

1+ parts

-

100+ parts

$49.469

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302

-

$49.469

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Kepictronics

USA . 100 parts In-Stock

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-

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100

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5502IRGZR microcontroller. Designed to meet the highest quality standards, this versatile device offers unmatched performance and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides a seamless user experience and exceptional value. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Step into the future with the MSP430F5502IRGZR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for compact design, making the microcontroller suitable for small and portable devices.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V provides flexibility in power supply options for different applications.

On Chip Data RAM Width: 8

Having a wider data RAM width of 8 bits allows for efficient data handling and processing.

Package Shape: SQUARE

The square package shape helps in easy mounting and integration into circuit boards.

Bit Size: 16

A 16-bit architecture allows for more complex operations and calculations to be performed by the microcontroller.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) enables compatibility with a wide range of peripherals and components.

No. of Terminals: 48

Having a higher number of terminals provides more connectivity options and interfaces for the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer versatility and thermal management capabilities for different application requirements.

Technical Specifications

Microcontrollers MSP430F5502IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5502IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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