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MSP430F5438IPZ

Texas Instruments

MSP430F5438IPZ by Texas Instruments

MSP430F5438IPZ by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 32 MHz. It features 16-channel, 12-bit analog-to-digital converters and offers connectivity options such as I2C, IRDA, SCI, and SPI. This microcontroller is commonly used in industrial applications due to its low power mode and wide temperature range.

Median Price

$16.185

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$14.800

100+ parts

$10.200

1k+ parts

$7.520

10k+ parts

$7.190

25

$14.800

$10.200

$7.520

$7.190

Mouser Electronics

USA . 60 parts In-Stock

1+ parts

$17.570

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$11.720

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$11.160

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-

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$17.570

$11.720

$11.160

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DigiKey

USA . 48 parts In-Stock

1+ parts

$17.570

100+ parts

$12.110

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$11.259

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-

48

$17.570

$12.110

$11.259

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Rochester

USA . 8 parts In-Stock

1+ parts

-

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$8.920

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$7.980

10k+ parts

$7.510

8

-

$8.920

$7.980

$7.510

Distributors (In-Stock)

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Digiode

USA . 800 parts In-Stock

1+ parts

$7.125

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$7.125

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Forefront Electronics and Design

USA . 27 parts In-Stock

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$8.580

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$8.580

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Nova Conductors

Japan . 10 parts In-Stock

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$11.017

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$11.017

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Chip Stock

USA . 5,500 parts In-Stock

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Vyrian

USA . 4,561 parts In-Stock

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NexGen Digital

USA . 56 parts In-Stock

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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ComSIT USA

USA . 40 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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North Shore Components

USA . 10 parts In-Stock

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Electronics Depot

USA . 6 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,938 parts In-Stock

1+ parts

$6.750

100+ parts

-

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4,938

$6.750

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AZTECH Wire

Italy . 218 parts In-Stock

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$6.911

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$6.911

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Ampacity Inc.

Singapore . 114 parts In-Stock

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$7.040

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$7.040

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Continental Prestige Electronics

USA . 5,942 parts In-Stock

1+ parts

$11.017

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-

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$10.796

5,942

$11.017

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$10.796

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$11.017

100+ parts

$10.796

1k+ parts

$10.466

10k+ parts

$10.245

2,000

$11.017

$10.796

$10.466

$10.245

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$11.237

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$11.237

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$11.237

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70

$11.237

$11.237

$11.237

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Parana Technologies

USA . 1,406 parts In-Stock

1+ parts

$32.444

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$105.491

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$32.444

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$105.491

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DigiPath Technology Company

USA . 240 parts In-Stock

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$35.725

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$35.725

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ChromeModa Solutions

Germany . 1,655 parts In-Stock

1+ parts

$36.454

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$29.892

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$36.454

$29.892

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IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$36.454

100+ parts

$34.631

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$32.809

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479

$36.454

$34.631

$32.809

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Corohmni

South Africa . 585 parts In-Stock

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$61.746

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$61.746

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Lixinc

USA . 7,770 parts In-Stock

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Microchip USA

USA . 4,782 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 1,739 parts In-Stock

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Argo Parts USA

USA . 1,287 parts In-Stock

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GreenTree Electronics

Israel . 899 parts In-Stock

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Infinite Electronics LLP (Excess)

. 634 parts In-Stock

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Benley Electronics

USA . 357 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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Overview

Discover the next level in microcontroller technology with the MSP430F5438IPZ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. The MSP430F5438IPZ offers a wide range of applications, making it perfect for various projects. With its advanced features and high-performance capabilities, this microcontroller provides unparalleled value to customers. Experience the benefits of its low power mode, extensive I/O lines, and onboard peripherals such as timers and analog-to-digital converters. Trust Texas Instruments to empower your innovations with the MSP430F5438IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the microcontroller suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, enhancing the overall efficiency of the design and reducing space requirements.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile and compatible with various power sources.

On Chip Data RAM Width: 8

The wide data RAM width allows for faster data processing and storage capabilities, improving overall performance and efficiency.

Package Shape: SQUARE

The square package shape offers better utilization of space on the circuit board, maximizing the available area for other components and optimizing the design layout.

Bit Size: 16

The 16-bit architecture provides enhanced computational capabilities and is suitable for sophisticated applications requiring extensive data processing.

Power Supplies (V): 2.5/3.3

The microcontroller's compatibility with multiple power supply voltages allows for flexibility in different system configurations, accommodating various voltage requirements.

No. of Terminals: 100

The high number of terminals ensures sufficient connectivity options, enabling the microcontroller to interface with multiple devices and peripherals for comprehensive functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers space-saving benefits, allowing for compact designs while still providing excellent performance and reliable connections.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage ensures efficient power consumption, making the microcontroller suitable for low-power applications where energy efficiency is essential.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can reliably operate in harsh environmental conditions, expanding its potential applications in industrial settings.

CPU Family: MSP430

Being part of the MSP430 family, this microcontroller benefits from a proven and reliable architecture, ensuring stable performance and easy integration with existing MSP430-based systems.

Minimum Operating Temperature: -40 °C

The wide temperature range tolerance allows the microcontroller to operate in extreme cold environments, making it suitable for diverse applications across different climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish with nickel, palladium, and gold provides excellent conductivity, minimizing signal loss and ensuring reliable connections for optimal performance.

ADC Channels: YES

The presence of analog-to-digital converter (ADC) channels enables the microcontroller to accurately measure and convert analog signals, making it suitable for applications requiring sensor interfacing.

DMA Channels: YES

The availability of direct memory access (DMA) channels allows for efficient data transfer between peripherals and memory, resulting in faster data processing and reduced CPU workload.

Terminal Position: QUAD

The quad terminal position simplifies the integration process, ensuring easy alignment and soldering while enabling robust and secure connections.

ROM Words: 262144

The large ROM size provides ample space for program storage, enabling the microcontroller to handle complex software algorithms and applications with extensive code requirements.

Maximum Seated Height: 1.6 mm

The low seated height supports the design of slim and compact devices, contributing to space-saving considerations and allowing for sleek product designs.

RAM Words: 16

The ample RAM size enables efficient data storage and manipulation during program execution, enhancing the microcontroller's ability to handle multiple tasks simultaneously.

Width: 14 mm

The compact width dimension ensures the microcontroller can fit into small form factor designs, accommodating space-constrained applications.

Boundary Scan: YES

The presence of boundary scan functionality facilitates efficient debugging and testing during the manufacturing process, ensuring higher product quality and faster time-to-market.

Peripherals: BOR, CRC, DMA(3), RTC, TIMER(15), WDT

The inclusion of various peripherals, such as brown-out reset (BOR), cyclic redundancy check (CRC), direct memory access (DMA), real-time clock (RTC), timers, and watchdog timer (WDT), broadens the microcontroller's capabilities, making it suitable for a wide range of applications.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency, this microcontroller can execute instructions quickly, enabling fast data processing and responsive system behavior.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller's ability to withstand high reflow temperatures for up to 30 seconds simplifies the manufacturing process, ensuring reliable soldering and enabling efficient production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering without compromising the microcontroller's functionality, ensuring reliable connections and longevity.

Length: 14 mm

The compact length dimension contributes to space-saving designs, allowing the microcontroller to fit into small form factor products without sacrificing performance.

Temperature Grade: INDUSTRIAL

The microcontroller's industrial temperature grade rating ensures reliable operation in harsh industrial environments, making it suitable for critical applications that demand robustness and temperature resistance.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller based on the reduced instruction set computer (RISC) architecture, this product offers efficient and streamlined execution of instructions, enabling high-performance computing in resource-constrained applications.

No. of Timers: 15

The abundance of timers provides versatile timing and scheduling capabilities, allowing the microcontroller to handle multiple time-sensitive tasks simultaneously.

RAM Bytes: 16384

The substantial RAM capacity in bytes enhances the microcontroller's ability to store and manipulate data efficiently, enabling complex data processing and multi-tasking operations.

Technology: CMOS

The complementary metal-oxide-semiconductor (CMOS) technology employed in this microcontroller offers low power consumption, making it ideal for battery-powered devices and energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies PCB assembly and soldering processes, ensuring reliable and secure connections for seamless integration into the circuit design.

Analog To Digital Convertors: 16-Ch 12-Bit

The presence of sixteen analog-to-digital converters (ADCs) with 12-bit resolution allows the microcontroller to handle multiple analog signals simultaneously, facilitating accurate data acquisition and sensor interfacing.

Maximum Supply Current: 5.56 mA

The low maximum supply current requirement helps reduce power consumption, extending battery life and enabling energy-efficient operation in portable or low-power applications.

Nominal Supply Voltage: 3 V

The specified nominal supply voltage ensures compatibility with commonly available power supply sources, simplifying system integration and power management considerations.

No. of DMA Channels: 3

The availability of three direct memory access (DMA) channels allows for efficient data transfer and reduces CPU overhead, enabling fast and reliable data handling.

No. of Serial I/Os: 3

The provision of three serial input/output (I/O) interfaces expands connectivity options, facilitating communication with other devices and enabling seamless data exchange.

PWM Channels: YES

The presence of pulse-width modulation (PWM) channels allows for precise control of analog signals, making the microcontroller well-suited for applications that require accurate motor control or power regulation.

Connectivity: I2C, IRDA, SCI(2), SPI

The inclusion of various connectivity options, such as I2C, infrared data association (IRDA), synchronous communication interface (SCI), and serial peripheral interface (SPI), enhances the microcontroller's versatility, enabling seamless integration with a wide range of external devices and systems.

ROM Programmability: FLASH

The microcontroller's flash programmability feature enables easy and flexible updates or modifications to the firmware, reducing development time and allowing for future enhancements or bug fixes.

Terminal Pitch: 0.5 mm

The small terminal pitch ensures compatibility with modern PCB design standards, enabling tight integration and high-density circuit layouts.

Format: FIXED POINT

The microcontroller's fixed-point format simplifies mathematical operations, making it suitable for applications requiring precise calculations in various fields such as signal processing or control systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 rating indicates that the microcontroller can withstand moderate exposure to moisture during storage or assembly, ensuring product reliability and reducing the risk of failure.

Speed: 18 rpm

The specified speed indicates the maximum rotational speed capability of the microcontroller or its associated peripherals, enabling precise motor control or timing applications.

Low Power Mode: YES

The inclusion of low power mode capabilities allows the microcontroller to operate in energy-saving modes when idle or in low-demand scenarios, maximizing power efficiency and increasing battery life.

On Chip Program ROM Width: 8

The wide on-chip program ROM width ensures efficient storage and execution of program instructions, enabling the microcontroller to support complex software algorithms and applications.

No. of I/O Lines: 87

The high number of input/output (I/O) lines provides extensive connectivity options, facilitating interfacing with external devices and allowing for more versatile system configurations.

Technical Specifications

Microcontrollers MSP430F5438IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

87

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

18 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI"

Peripherals:

"BOR, CRC, DMA(3), RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5438IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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