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MSP430F5418IPN

Texas Instruments

MSP430F5418IPN by Texas Instruments

MSP430F5418IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 16 ADC channels, 3 DMA channels, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$6.780

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 127 parts In-Stock

1+ parts

$13.420

100+ parts

$9.845

1k+ parts

$8.409

10k+ parts

$8.257

127

$13.420

$9.845

$8.409

$8.257

Arrow

USA . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.780

10k+ parts

-

238

-

-

$6.780

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Rochester

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$6.640

1k+ parts

$5.940

10k+ parts

$5.590

26

-

$6.640

$5.940

$5.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,846 parts In-Stock

1+ parts

$6.090

100+ parts

-

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3,846

$6.090

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Chip Stock

USA . 7,300 parts In-Stock

1+ parts

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7,300

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Vyrian

USA . 6,695 parts In-Stock

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6,695

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LWI Electronics Inc

India . 431 parts In-Stock

1+ parts

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431

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ComSIT Distribution GmbH

Germany . 75 parts In-Stock

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75

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ComSIT USA

USA . 75 parts In-Stock

1+ parts

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75

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Electronics Depot

USA . 56 parts In-Stock

1+ parts

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56

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Ashlea Components Ltd

UK . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,187 parts In-Stock

1+ parts

$5.769

100+ parts

-

1k+ parts

-

10k+ parts

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3,187

$5.769

-

-

-

Microchip USA

USA . 1,427 parts In-Stock

1+ parts

$32.310

100+ parts

$31.850

1k+ parts

$31.620

10k+ parts

$31.390

1,427

$32.310

$31.850

$31.620

$31.390

Parana Technologies

USA . 136 parts In-Stock

1+ parts

$59.144

100+ parts

-

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136

$59.144

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DigiPath Technology Company

USA . 875 parts In-Stock

1+ parts

$65.125

100+ parts

$59.915

1k+ parts

-

10k+ parts

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875

$65.125

$59.915

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ChromeModa Solutions

Germany . 5,200 parts In-Stock

1+ parts

$66.454

100+ parts

$54.492

1k+ parts

-

10k+ parts

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5,200

$66.454

$54.492

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$66.454

100+ parts

$63.131

1k+ parts

$59.809

10k+ parts

-

1,172

$66.454

$63.131

$59.809

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Lixinc

USA . 14,865 parts In-Stock

1+ parts

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14,865

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Futuretech Components

Singapore . 829 parts In-Stock

1+ parts

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829

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iodParts Technologies Inc.

India . 75 parts In-Stock

1+ parts

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100+ parts

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75

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5418IPN microcontroller. Designed with precision and quality in mind, this versatile device offers a world of possibilities for applications in various industries. With advanced features like powerful ADC channels, multiple timers, and low power modes, this microcontroller provides unmatched performance and efficiency. Experience seamless connectivity and reliable operation with the MSP430 series from Texas Instruments, setting new standards in the world of microcontrollers. Elevate your projects to new heights with the MSP430F5418IPN - where excellence meets technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand tough environmental conditions without compromising performance.

ADC Channels: YES

The presence of Analog-to-Digital Converters allows for accurate conversion of analog signals, making it ideal for applications requiring sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller, it offers high performance and efficiency in handling complex instructions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of devices such as motors, LEDs, and other hardware, enhancing the microcontroller's versatility.

Connectivity: I2C, IRDA, SCI(2), SPI

Multiple communication interfaces provide flexibility in connecting to other devices or peripherals, enhancing the microcontroller's networking capabilities.

Low Power Mode: YES

The availability of low power mode aids in reducing power consumption during idle or low-load operation, prolonging battery life in portable applications.

Technical Specifications

Microcontrollers MSP430F5418IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ITS ALSO OPERATES MINIMUM 1.8V AT 12MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

67

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

18 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI"

Peripherals:

"BOR, CRC, DMA(3), RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5418IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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