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MSP430F5359IZQWR

Texas Instruments

MSP430F5359IZQWR by Texas Instruments

MSP430F5359IZQWR by Texas Instruments is a 16-bit microcontroller with 524288 ROM words and 66 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 2-Ch 12-Bit DAC channels, 16-Ch 12-Bit ADC channels, and connectivity options including I2C, SPI, UART, it offers versatile solutions in embedded systems design.

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Chip Stock

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USA . 1,522 parts In-Stock

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AZTECH Wire

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Ampacity Inc.

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Corohmni

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Parana Technologies

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DigiPath Technology Company

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5359IZQWR microcontroller. Designed for maximum performance, this versatile device offers exceptional quality and reliability to meet your project needs. With a wide range of applications in various industries, the MSP430F5359IZQWR delivers outstanding value and benefits to customers seeking cutting-edge technology. Trust Texas Instruments for superior products that push boundaries and drive success. Choose the MSP430F5359IZQWR for unrivaled performance and endless possibilities.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and compact applications.

Surface Mount YES

Surface mount design allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage 3.6 V

Supports a maximum supply voltage of 3.6V, suitable for a wide range of electronic devices and applications.

Bit Size 16

16-bit architecture offers improved data processing capabilities and performance for complex algorithms and calculations.

DAC Channels YES

Integrated DAC channels provide analog output capabilities, enabling the generation of accurate and precise voltage levels for various functions.

Power Supplies (V) 2/3.3

Supports multiple power supply voltages (2V and 3.3V), offering flexibility and compatibility with different voltage requirements in a system.

No. of Terminals 113

Ample number of terminals allow for easy connectivity to peripherals, sensors, and external devices, enhancing the overall functionality of the microcontroller.

Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design facilitates compact and space-saving PCB layouts, improving overall system integration.

Minimum Supply Voltage 2.4 V

Supports a minimum supply voltage of 2.4V, ensuring reliable operation even under low power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature 85 °C

High maximum operating temperature of 85°C ensures stable performance even in harsh environmental conditions or extended operation durations.

CPU Family MSP430

Belonging to the MSP430 CPU family ensures compatibility with existing software and tools, simplifying development and integration processes.

No. of External Interrupts 8

Support for 8 external interrupts allows for efficient handling of external events and real-time response, enhancing system responsiveness and control.

Minimum Operating Temperature -40 °C

Low minimum operating temperature of -40°C ensures reliable operation in cold environments or during temperature fluctuations.

Terminal Finish TIN SILVER COPPER

Tin silver copper terminal finish enhances solderability and reliability of the connections, ensuring a robust and long-lasting electrical contact.

ADC Channels YES

Onboard ADC channels enable accurate analog-to-digital conversion, facilitating sensor data acquisition and signal processing in a variety of applications.

DMA Channels YES

Multiple DMA channels offer efficient data transfer capabilities, reducing CPU overhead and improving system performance in data-intensive tasks.

Terminal Position BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and overall system design.

ROM Words 524288

Large ROM capacity of 524288 words provides ample storage for program code and data, allowing for the implementation of complex algorithms and applications.

Maximum Seated Height 1 mm

Low maximum seated height of 1mm allows for slim and compact device designs, suitable for space-constrained applications.

Digital To Analog Convertors 2-Ch 12-Bit

Integrated 2-channel 12-bit DACs offer high-resolution analog output capabilities, enabling precise control and generation of analog signals.

RAM Words 66

Sufficient RAM capacity of 66 words for data storage and processing, supporting multitasking and efficient operation of software algorithms.

Width 7 mm

Compact width of 7mm enables space-efficient PCB designs, ideal for applications where size constraints are a concern.

Boundary Scan YES

Boundary scan feature facilitates PCB testing and debugging, ensuring quality control and reliability during production and maintenance phases.

Peripherals BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Rich set of peripherals including Brown Out Reset, Comparator, DMA, Power-On Reset, PWM, Real-Time Clock, Timers, and Watchdog Timer enhance the microcontroller's functionality and versatility.

Maximum Clock Frequency 32 MHz

High maximum clock frequency of 32MHz enables fast data processing and execution of instructions, enhancing overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s) 30

Allows for a maximum reflow temperature time of 30 seconds, ensuring proper solder reflow and component reliability during manufacturing processes.

Peak Reflow Temperature °C 260

Handles peak reflow temperatures of 260°C, meeting industry standards for lead-free soldering processes and ensuring mechanical robustness.

Length 7 mm

Compact length of 7mm contributes to a small form factor design, suitable for applications where space optimization is essential.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient data processing and power consumption, ideal for embedded control systems and IoT devices.

No. of Timers 4

Multiple timers provide timing and scheduling capabilities, facilitating precise control and coordination of tasks in time-critical applications.

RAM Bytes 67584

Generous RAM size of 67584 bytes enables efficient data storage and manipulation, supporting memory-intensive applications and multitasking scenarios.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient operation and reliable performance in various operating conditions.

Terminal Form BALL

Ball terminal form simplifies assembly and rework processes, ensuring easy and reliable solder joint connections for hassle-free PCB manufacturing and maintenance.

Analog To Digital Convertors 16-Ch 12-Bit

Integrated 16-channel 12-bit ADCs provide high-precision analog-to-digital conversion capabilities, supporting multiple sensor inputs and accurate data acquisition.

Nominal Supply Voltage 3.3 V

Nominal supply voltage of 3.3V offers compatibility with standard power sources and components, simplifying system integration and power management.

No. of DMA Channels 6

Having 6 DMA channels enables efficient data transfer and processing, reducing CPU workload and enhancing system performance in data-intensive applications.

No. of Serial I/Os 2

2 serial I/O ports allow for communication with external devices and peripherals, expanding connectivity options and enabling data exchange in serial communication protocols.

PWM Channels YES

Support for PWM channels enables precise control and modulation of analog output signals, facilitating tasks such as motor speed control and LED dimming.

Connectivity I2C(3), IRDA(3), SPI(6), UART(3)

Multiple connectivity options including I2C, IRDA, SPI, and UART allow for flexible communication with a variety of devices and peripherals, enhancing system interoperability.

ROM Programmability FLASH

Flash programmable ROM allows for easy and convenient firmware updates and customization, enabling quick iterations and enhancements to the device functionality.

Terminal Pitch 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layouts and compact designs, suitable for space-constrained applications and miniaturized devices.

Format FIXED POINT

Fixed-point arithmetic format simplifies mathematical calculations and resource utilization, offering efficiency and predictability in numerical operations.

Technical Specifications

Microcontrollers MSP430F5359IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

74

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

0

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

67584

RAM Words:

66

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F5359IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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