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MSP430F5341IRGZR

Texas Instruments

MSP430F5341IRGZR by Texas Instruments

MSP430F5341IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 9 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.056

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,359 parts In-Stock

1+ parts

$5.056

100+ parts

$4.122

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$2.748

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9,359

$5.056

$4.122

$2.748

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Nova Conductors

Japan . 15 parts In-Stock

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$2.748

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-

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15

$2.748

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Digiode

USA . 3,291 parts In-Stock

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$4.803

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3,291

$4.803

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Vyrian

USA . 6,546 parts In-Stock

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Continental Prestige Electronics

USA . 5,561 parts In-Stock

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$2.748

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$2.693

5,561

$2.748

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$2.693

Argo Parts USA

USA . 270 parts In-Stock

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$2.748

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270

$2.748

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Ampacity Inc.

Singapore . 8,956 parts In-Stock

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$4.300

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8,956

$4.300

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Corphita

USA . 3,185 parts In-Stock

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$4.550

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AZTECH Wire

Italy . 156 parts In-Stock

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$21.570

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Microchip USA

USA . 2,183 parts In-Stock

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$25.007

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$25.007

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$43.665

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$39.735

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$35.805

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500

$43.665

$39.735

$35.805

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Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

$53.161

100+ parts

$4,936.850

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$47.845

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1,413

$53.161

$4,936.850

$47.845

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DigiPath Technology Company

USA . 537 parts In-Stock

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$58.537

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537

$58.537

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ChromeModa Solutions

Germany . 4,247 parts In-Stock

1+ parts

$59.732

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$48.980

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4,247

$59.732

$48.980

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IDEA Electronic Components Group

UK . 1,449 parts In-Stock

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$59.732

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$56.745

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$53.759

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1,449

$59.732

$56.745

$53.759

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Corohmni

South Africa . 59 parts In-Stock

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$64.461

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59

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Lixinc

USA . 5,457 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$2.693

1k+ parts

$2.611

10k+ parts

$2.556

1,000

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$2.693

$2.611

$2.556

A-Z Elektronik GmbH

Germany . 500 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5341IRGZR microcontroller. Designed for high-performance applications, this versatile chip offers unmatched reliability and precision. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller delivers top-notch performance and efficiency. Trust in Texas Instruments' legacy of excellence and experience the countless benefits and advantages that the MSP430F5341IRGZR brings to your projects. Elevate your designs and stay ahead of the competition with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and reliability for long-term usage.

Surface Mount:

YES - Allows for easy and convenient installation on PCBs.

Maximum Supply Voltage:

3.6 V - Provides sufficient power for efficient performance.

On Chip Data RAM Width:

8 - Enables fast and efficient data processing.

Package Shape:

SQUARE - Offers a compact and space-saving design for easy integration.

Bit Size:

16 - Provides high processing capability for complex tasks.

Power Supplies (V):

2/3.3 - Flexibility in power input options for different applications.

No. of Terminals:

48 - Sufficient connectivity options for various external components.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Versatile package styles for diverse mounting methods.

Minimum Supply Voltage:

2.4 V - Ensures reliable operation even at lower voltages.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments with high temperature requirements.

CPU Family:

MSP430 - Known for its power efficiency and performance.

Minimum Operating Temperature:

40 °C - Ideal for applications requiring operation in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance and reliable electrical connections.

ADC Channels:

YES - Enables analog to digital conversion for sensor interfacing.

DMA Channels:

YES - Facilitates efficient data transfer for improved performance.

Terminal Position:

QUAD - Easy connection layout for simplified PCB design.

ROM Words:

98304 - Ample storage capacity for program and data storage.

Maximum Seated Height:

1 mm - Low-profile design for space-constrained applications.

RAM Words:

8 - Sufficient memory for temporary data storage.

Width:

7 mm - Compact form factor for easy integration in tight spaces.

Boundary Scan:

YES - Allows for testing and debugging during production and maintenance.

Peripherals:

BOR, COMPARATOR, CRC, DMA(3), RTC, TIMER(19), WDT - Wide range of integrated peripherals for enhanced functionality.

Maximum Clock Frequency:

32 MHz - Offers high processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable soldering during manufacturing process.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during assembly process.

Length:

7 mm - Compact dimensions for space-efficient design.

Temperature Grade:

INDUSTRIAL - Suitable for harsh industrial environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - Features a powerful and efficient RISC-based architecture.

No. of Timers:

19 - Multiple timers for precise timing and control functions.

RAM Bytes:

8192 - Sufficient memory capacity for data storage.

Technology:

CMOS - Low power consumption and high noise immunity for reliable operation.

Terminal Form:

NO LEAD - Lead-free terminal form for environment-friendly manufacturing.

Analog To Digital Convertors:

9-Ch 12-Bit - Multiple ADC channels for accurate analog signal conversion.

Maximum Supply Current:

11 mA - Low power consumption for energy-efficient operation.

Nominal Supply Voltage:

3.3 V - Standard voltage supply for compatibility with various systems.

No. of DMA Channels:

3 - Multiple DMA channels for efficient data transfer.

No. of Serial I/Os:

2 - Serial interfaces for communication with external devices.

PWM Channels:

YES - Supports pulse width modulation for motor control and dimming applications.

Connectivity:

I2C, IRDA, SPI(2), UART, USCI(3) - Versatile connectivity options for communication with external devices.

ROM Programmability:

FLASH - Allows for easy reprogramming of firmware.

Terminal Pitch:

0.5 mm - Fine pitch for compact and high-density PCB layouts.

Format:

FIXED POINT - Accurate fixed-point arithmetic for precise calculations.

Moisture Sensitivity Level (MSL):

3 - Suitable for reflow soldering processes with medium sensitivity to moisture.

Speed:

25 rpm - Rotational speed specification for specific applications.

Low Power Mode:

YES - Energy-saving mode for prolonged battery life.

On Chip Program ROM Width:

8 - Efficient program ROM width for fast code execution.

No. of I/O Lines:

38 - Multiple I/O lines for versatile interfacing with external peripherals.

Technical Specifications

Microcontrollers MSP430F5341IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MIN SUPPLY AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

38

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

19

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART, USCI(3)

Peripherals:

BOR, COMPARATOR, CRC, DMA(3), RTC, TIMER(19), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

MSP430F5341IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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