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MSP430F5336IPZ

Texas Instruments

MSP430F5336IPZ by Texas Instruments

MSP430F5336IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 18 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, UART, and USCI interfaces.

Median Price

$7.332

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,213 parts In-Stock

1+ parts

$6.015

100+ parts

$4.904

1k+ parts

$3.269

10k+ parts

-

3,213

$6.015

$4.904

$3.269

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Mouser Electronics

USA . 319 parts In-Stock

1+ parts

$8.650

100+ parts

$5.580

1k+ parts

$5.140

10k+ parts

-

319

$8.650

$5.580

$5.140

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DigiKey

USA . 85 parts In-Stock

1+ parts

$8.650

100+ parts

$5.737

1k+ parts

$5.173

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-

85

$8.650

$5.737

$5.173

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Rochester

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$4.700

1k+ parts

$4.210

10k+ parts

$3.960

27

-

$4.700

$4.210

$3.960

Distributors (In-Stock)

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Digiode

USA . 3,175 parts In-Stock

1+ parts

$4.313

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3,175

$4.313

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Vyrian

USA . 5,869 parts In-Stock

1+ parts

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5,869

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Bristol Electronics

USA . 90 parts In-Stock

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90

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 758 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

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758

$3.860

-

-

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Corphita

USA . 1,724 parts In-Stock

1+ parts

$4.086

100+ parts

-

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1,724

$4.086

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Parana Technologies

USA . 161 parts In-Stock

1+ parts

$13.402

100+ parts

-

1k+ parts

$13.917

10k+ parts

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161

$13.402

-

$13.917

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DigiPath Technology Company

USA . 461 parts In-Stock

1+ parts

$14.757

100+ parts

$13.576

1k+ parts

-

10k+ parts

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461

$14.757

$13.576

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ChromeModa Solutions

Germany . 5,142 parts In-Stock

1+ parts

$15.058

100+ parts

$12.348

1k+ parts

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5,142

$15.058

$12.348

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IDEA Electronic Components Group

UK . 206 parts In-Stock

1+ parts

$15.058

100+ parts

$14.305

1k+ parts

$13.552

10k+ parts

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206

$15.058

$14.305

$13.552

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Corohmni

South Africa . 638 parts In-Stock

1+ parts

$32.073

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638

$32.073

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Argo Parts USA

USA . 5,596 parts In-Stock

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5,596

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Continental Prestige Electronics

USA . 4,529 parts In-Stock

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4,529

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Netroflash

USA . 2,000 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5336IPZ microcontroller. Designed for a wide range of applications, this high-quality device offers unmatched performance and reliability. With advanced features such as low power mode, multiple timers, and connectivity options like I2C and UART, this microcontroller is perfect for industrial-grade projects. Trust in Texas Instruments' reputation for excellence and elevate your designs with the MSP430F5336IPZ. Experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and heat resistance.

Surface Mount: YES

Surface mount technology allows for compact and lightweight PCB designs.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, making it versatile for different applications.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage.

Package Shape: SQUARE

Square shape is space-efficient and fits well on PCB layouts.

Bit Size: 16

16-bit architecture offers higher processing capabilities compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels allow for analog signal outputs.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enhances compatibility with various systems.

No. of Terminals: 100

Having a large number of terminals provides flexibility in connecting peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and reliable form factor for easy integration.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, suitable for industrial environments.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility and synergy with other MSP430 devices.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and ensures reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to process analog inputs.

DMA Channels: YES

Direct memory access channels improve data transfer speeds and efficiency.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and mechanical strength.

ROM Words: 131072

Large ROM capacity allows for storing extensive program instructions.

Maximum Seated Height: 1.6 mm

Low profile design enables compact PCB layouts and saves space.

RAM Words: 18

Adequate RAM words for efficient data processing and temporary storage.

Width: 14 mm

Compact width facilitates space-saving PCB designs.

Boundary Scan: YES

Boundary scan support aids in testing and troubleshooting PCBs during manufacturing.

Peripherals: "BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT

A wide range of peripherals offer versatile functionality for diverse applications.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can endure reflow soldering processes for reliable solder joints.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures proper soldering connections.

Length: 14 mm

Compact length facilitates space-saving PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and control.

No. of Timers: 18

Multiple timers provide precise timing functions for various applications.

RAM Bytes: 18432

Sufficient RAM capacity for storing and processing data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form ensures secure solder connections for reliability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

No. of DMA Channels: 6

Multiple DMA channels enhance data transfer speeds and efficiency.

PWM Channels: YES

Pulse-width modulation channels for precise control of analog signals.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI

Diverse connectivity options for communication with other devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact PCB designs and high-density integration.

Format: FIXED POINT

Fixed-point format is suitable for numerical calculations and processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the component can withstand standard moisture exposure levels.

Speed: 20 rpm

Capable of processing data at a speed of 20 revolutions per minute.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and prolongs battery life.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 allows for storing program instructions.

No. of I/O Lines: 74

A high number of I/O lines provide flexible interfacing with external devices.

Technical Specifications

Microcontrollers MSP430F5336IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5336IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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