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MSP430F5335IZQWR

Texas Instruments

MSP430F5335IZQWR by Texas Instruments

MSP430F5335IZQWR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 18 RAM words. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. Features include 18 timers, I2C, SPI, UART connectivity, and DMA channels for efficient data transfer.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 329 parts In-Stock

1+ parts

$6.720

100+ parts

$2.912

1k+ parts

$2.755

10k+ parts

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329

$6.720

$2.912

$2.755

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Vyrian

USA . 4,900 parts In-Stock

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4,900

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Digiode

USA . 4,609 parts In-Stock

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4,609

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NexGen Digital

USA . 500 parts In-Stock

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500

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ACDS - Activité Composants Distribution Service

France . 329 parts In-Stock

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329

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Dan-Mar Components

USA . 329 parts In-Stock

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329

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Distributors (Availability)

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AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$9.421

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321

$9.421

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One Stop Electronics

USA . 817 parts In-Stock

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$24.000

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817

$24.000

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Parana Technologies

USA . 482 parts In-Stock

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$76.424

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482

$76.424

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ChromeModa Solutions

Germany . 1,982 parts In-Stock

1+ parts

$85.870

100+ parts

$70.413

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1,982

$85.870

$70.413

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IDEA Electronic Components Group

UK . 1,752 parts In-Stock

1+ parts

$85.870

100+ parts

$81.576

1k+ parts

$77.283

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1,752

$85.870

$81.576

$77.283

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Component Stockers USA

USA . 490 parts In-Stock

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$99.990

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490

$99.990

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Perfect Parts

USA . 59,324 parts In-Stock

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59,324

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,716 parts In-Stock

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4,716

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Microchip USA

USA . 4,192 parts In-Stock

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4,192

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DigiPath Technology Company

USA . 1,626 parts In-Stock

1+ parts

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$77.420

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1,626

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$77.420

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Overview

Elevate your projects with the Texas Instruments MSP430F5335IZQWR Microcontroller, a powerful and versatile solution for a wide range of applications. With its top-notch quality and reliable performance, this product is a game-changer in the industry. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F5335IZQWR delivers exceptional value and benefits to customers by offering low power consumption, advanced connectivity options, and a robust set of peripherals. Trust Texas Instruments to provide cutting-edge technology that pushes boundaries and unlocks new possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easier to handle and resistant to damage during handling and installation.

Surface Mount: YES

Surface mount technology enables easy and efficient mounting of the microcontroller onto a circuit board, saving space and allowing for automated assembly processes.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power input options, enabling compatibility with a wider range of power sources.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and storage, enhancing the microcontroller's performance capabilities.

Package Shape: SQUARE

The square package shape ensures efficient use of space on a circuit board and facilitates easier placement and alignment during assembly.

Bit Size: 16

A larger bit size enables the microcontroller to handle more complex computations and operations, making it suitable for demanding applications.

Power Supplies (V): 2/3.3

The dual power supply options provide flexibility in voltage input, allowing for compatibility with different power sources and voltage requirements.

No. of Terminals: 113

The high number of terminals enables the microcontroller to interface with a wide range of external components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact and thin profile, ideal for space-constrained applications and high-density circuit designs.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage allows for efficient operation with lower power sources, enhancing energy efficiency and reducing power consumption.

Technical Specifications

Microcontrollers MSP430F5335IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

RAM Words:

18

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Trade Compliance

MSP430F5335IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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