Loading...

MSP430F5335IZCAR

Texas Instruments

MSP430F5335IZCAR by Texas Instruments

MSP430F5335IZCAR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 9216 RAM words. It features 16 ADC channels, 4 timers, and connectivity options like I2C, SPI, UART. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85 °C, and max clock frequency of 32 MHz.

Median Price

$7.044

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,395 parts In-Stock

1+ parts

$7.044

100+ parts

$5.742

1k+ parts

$3.828

10k+ parts

-

10,395

$7.044

$5.742

$3.828

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,941 parts In-Stock

1+ parts

$6.692

100+ parts

-

1k+ parts

-

10k+ parts

-

4,941

$6.692

-

-

-

Vyrian

USA . 4,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,755

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,500 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$6.340

-

-

-

AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$9.730

100+ parts

-

1k+ parts

-

10k+ parts

-

347

$9.730

-

-

-

Microchip USA

USA . 4,733 parts In-Stock

1+ parts

$15.006

100+ parts

-

1k+ parts

-

10k+ parts

-

4,733

$15.006

-

-

-

Parana Technologies

USA . 361 parts In-Stock

1+ parts

$34.103

100+ parts

$3,166.983

1k+ parts

$30.693

10k+ parts

-

361

$34.103

$3,166.983

$30.693

-

DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$37.552

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$37.552

-

-

-

ChromeModa Solutions

Germany . 1,626 parts In-Stock

1+ parts

$38.318

100+ parts

$31.421

1k+ parts

-

10k+ parts

-

1,626

$38.318

$31.421

-

-

IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$38.318

100+ parts

$36.402

1k+ parts

$34.486

10k+ parts

-

564

$38.318

$36.402

$34.486

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5335IZCAR Microcontroller. With top-notch quality and reliability, Texas Instruments is a trusted name in the industry. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're looking to optimize energy efficiency, enhance performance, or streamline your design process, this product delivers on all fronts. Invest in innovation with the MSP430F5335IZCAR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage range, providing flexibility in power supply options for different system requirements.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage, enhancing overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape offers a compact design, saving space on the PCB and enabling integration into smaller electronic devices.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and performance for handling complex tasks and calculations.

No. of Terminals: 113

Ample terminals offer various connectivity options and interfaces for connecting external peripherals and components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design ensures high-density mounting and reliable solder connections.

Minimum Supply Voltage: 2.4 V

Supports a low minimum supply voltage, enabling power-efficient operation and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in harsh environmental conditions and industrial applications.

CPU Family: MSP430

MSP430 CPU family is known for low power consumption, high performance, and versatility, making it a reliable choice for embedded systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures operation in extreme cold conditions, suitable for outdoor and industrial applications.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent solderability, corrosion resistance, and long-term reliability for the microcontroller.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion, allowing the microcontroller to interface with various sensors and input devices.

DMA Channels: YES

DMA channels improve data transfer speeds and reduce CPU load, enhancing overall system performance and efficiency.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing space utilization and facilitating easier assembly.

ROM Words: 262144

Large ROM capacity allows for storing program code and data, supporting advanced applications and firmware upgrades.

Maximum Seated Height: 1 mm

Low seated height enables compact board design and facilitates assembly in slim electronic devices with space constraints.

RAM Words: 9216

Ample RAM capacity enables efficient data processing, storage, and multitasking capabilities, enhancing overall system performance.

Width: 7 mm

Narrow width profile facilitates board layout and integration into space-constrained applications, offering design flexibility.

Boundary Scan: YES

Boundary scan feature simplifies testing and debugging during production, ensuring high manufacturing yield and quality control.

Peripherals: COMPARATOR(12), DMA, POR, PWM, RTC, TIMER(4), WDT

Wide range of peripherals offers versatile functionality and connectivity options for interfacing with external devices and components.

Maximum Clock Frequency: 32 MHz

High clock frequency provides fast processing speeds and real-time response, suitable for time-critical applications and high-speed communication.

Maximum Time At Peak Reflow Temperature (s): 30

30-second peak reflow time ensures proper soldering and reliability during the manufacturing process, maintaining product quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering processes, meeting RoHS compliance standards for environmentally friendly manufacturing.

Length: 7 mm

Compact length dimension allows for space-saving PCB layout and integration into small form factor devices, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with temperature fluctuations and industrial automation applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and power-optimized processing, ideal for embedded control systems and IoT devices.

No. of Timers: 4

Multiple timer channels enable precise timing control, event scheduling, and synchronization in applications requiring time-based operations.

RAM Bytes: 18432

Large RAM capacity in bytes provides ample space for data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the microcontroller energy-efficient and durable.

Terminal Form: BALL

Ball terminal form simplifies PCB assembly, provides secure solder connections, and supports high pin count devices for advanced electronic systems.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel 12-bit ADC converters enable precise analog to digital conversion, supporting sensor interfacing, data acquisition, and measurement applications.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation, providing a suitable power source for the microcontroller.

No. of DMA Channels: 6

6 DMA channels offer efficient data transfer and processing capabilities, reducing CPU overhead and improving overall system performance.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, supporting motor drive, LED dimming, and power management applications.

Connectivity: I2C(2), SPI(4), UART(2)

Multiple connectivity options including I2C, SPI, and UART interfaces allow for flexible communication with external devices, sensors, and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates, customization, and storage of program code, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm ensures high-density mounting, precise solder connections, and compact PCB layout for space-constrained applications.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and calculations, providing efficient processing of numerical data in embedded control applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, requiring standard handling and storage precautions to maintain component reliability.

Speed: 20 rpm

Operating speed of 20 rpm ensures fast data processing, response times, and real-time performance for time-sensitive control applications.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency, prolongs battery life, and reduces power consumption in battery-operated devices.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides efficient storage and execution of program instructions, supporting embedded software development.

No. of I/O Lines: 74

74 I/O lines offer versatile connectivity and interface options for connecting external devices, sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers MSP430F5335IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

18432

RAM Words:

9216

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2)

Peripherals:

COMPARATOR(12), DMA, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F5335IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20