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MSP430F5309IPT

Texas Instruments

MSP430F5309IPT by Texas Instruments

MSP430F5309IPT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 8-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications due to -40 to 85 °C operating temp range and low power mode. Features include BOD, CRC, DMA(3), PWM, RTC, WDT for versatile connectivity via I2C(2), IRDA(2), LIN(2), SPI(4), UART interfaces.

Median Price

$3.038

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,864 parts In-Stock

1+ parts

$3.038

100+ parts

$2.662

1k+ parts

$1.504

10k+ parts

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6,864

$3.038

$2.662

$1.504

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,945 parts In-Stock

1+ parts

$2.886

100+ parts

-

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2,945

$2.886

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Vyrian

USA . 3,306 parts In-Stock

1+ parts

-

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3,306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,950 parts In-Stock

1+ parts

$2.734

100+ parts

-

1k+ parts

-

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1,950

$2.734

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$17.650

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281

$17.650

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Microchip USA

USA . 2,817 parts In-Stock

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$21.111

100+ parts

-

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2,817

$21.111

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Parana Technologies

USA . 518 parts In-Stock

1+ parts

$68.269

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518

$68.269

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ChromeModa Solutions

Germany . 4,126 parts In-Stock

1+ parts

$76.707

100+ parts

$62.900

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4,126

$76.707

$62.900

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IDEA Electronic Components Group

UK . 1,419 parts In-Stock

1+ parts

$76.707

100+ parts

$72.872

1k+ parts

$69.036

10k+ parts

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1,419

$76.707

$72.872

$69.036

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DigiPath Technology Company

USA . 1,164 parts In-Stock

1+ parts

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100+ parts

$69.159

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1,164

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$69.159

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F5309IPT microcontroller. Trusted for its high-quality manufacturing and reliability, this device offers a wide range of applications in various industries. With features like low power consumption, multiple peripherals, and advanced connectivity options, this microcontroller provides unparalleled value and benefits to customers looking to take their projects to the next level. Experience the advantages of seamless integration and superior performance with the MSP430F5309IPT from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more flexibility in powering the device and handling different input voltages.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and efficient performance, making it a reliable choice for battery-powered applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance with reduced instruction set computing, enabling faster execution of instructions.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, the microcontroller can handle complex computations and processes at a faster speed.

RAM Bytes: 6144

Having a large RAM capacity allows for efficient data storage and processing, making it suitable for multitasking and memory-intensive applications.

Analog To Digital Convertors: 8-Ch 10-Bit

The multiple ADC channels with 10-bit resolution enable accurate analog-to-digital conversion, essential for precise sensor readings and data acquisition.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(4), UART

The variety of communication interfaces support seamless connectivity with external devices, enabling easy data transfer and communication in diverse systems.

Technical Specifications

Microcontrollers MSP430F5309IPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(4), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5309IPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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