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MSP430F5304IPT

Texas Instruments

MSP430F5304IPT by Texas Instruments

MSP430F5304IPT by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 18 timers. Ideal for industrial applications requiring low power consumption, it features 8-Ch 10-Bit ADCs, DMA support, and various peripherals like PWM and RTC.

Median Price

$2.838

Lifecycle Status

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3

In-Stock Inventory

1k+

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Texas Instruments

USA . 3,627 parts In-Stock

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$2.838

100+ parts

$2.344

1k+ parts

$1.267

10k+ parts

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3,627

$2.838

$2.344

$1.267

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Digiode

USA . 887 parts In-Stock

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$2.696

100+ parts

-

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887

$2.696

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Vyrian

USA . 6,758 parts In-Stock

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6,758

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Corphita

USA . 3,050 parts In-Stock

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$2.554

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3,050

$2.554

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Microchip USA

USA . 1,860 parts In-Stock

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$15.390

100+ parts

$15.290

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$15.250

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$15.200

1,860

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$15.290

$15.250

$15.200

AZTECH Wire

Italy . 1,190 parts In-Stock

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$18.820

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1,190

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Parana Technologies

USA . 192 parts In-Stock

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192

$52.135

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DigiPath Technology Company

USA . 247 parts In-Stock

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$57.407

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247

$57.407

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ChromeModa Solutions

Germany . 1,317 parts In-Stock

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$58.579

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$48.035

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1,317

$58.579

$48.035

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IDEA Electronic Components Group

UK . 1,027 parts In-Stock

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$58.579

100+ parts

$55.650

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$52.721

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1,027

$58.579

$55.650

$52.721

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Component Stockers USA

USA . 2,973 parts In-Stock

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2,973

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Perfect Parts

USA . 280 parts In-Stock

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Overview

Unlock endless possibilities with the MSP430F5304IPT microcontroller from Texas Instruments. Designed for industrial-grade applications, this powerful device offers low power consumption and high-speed performance. With a wide range of peripherals including PWM, RTC, and DMA, it provides unmatched flexibility for your projects. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and reliability that the MSP430F5304IPT brings to your designs. Elevate your creations with cutting-edge technology and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into PCB designs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power supply options.

On Chip Data RAM Width: 16

A wider on-chip data RAM width of 16 bits enables efficient data processing and storage.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB.

Bit Size: 16

The 16-bit architecture provides enhanced processing capabilities and performance.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in power management and optimization.

No. of Terminals: 48

A higher number of terminals allows for more connectivity options and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables compact and space-saving PCB design.

Minimum Supply Voltage: 2.4 V

Support for a minimum supply voltage of 2.4V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes the microcontroller suitable for industrial applications with demanding environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures reliable performance and compatibility with existing MSP430-based systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in harsh cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent electrical conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion for accurate sensor interfacing and data acquisition.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer between memory and peripherals, improving overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies soldering and connection processes during PCB assembly.

ROM Words: 8192

The large ROM capacity of 8192 words enables storing of program instructions for complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm facilitates slim and compact device design.

RAM Words: 3072

The ample RAM capacity of 3072 words supports efficient data storage and manipulation during program execution.

Width: 7 mm

The compact width of 7mm makes the microcontroller suitable for space-constrained designs.

Boundary Scan: YES

Boundary scan support allows for easy testing and debugging of the microcontroller during production and maintenance.

Peripherals: BOD, CRC, DMA(3), PWM, RTC, TIMER(18), WDT

The presence of various peripherals like BOD, CRC, DMA, PWM, RTC, Timer, and WDT enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32MHz enables fast processing speed and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring robustness during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and assembly processes.

Length: 7 mm

The compact length of 7mm contributes to a smaller overall footprint on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and streamlined operation for faster execution of instructions.

No. of Timers: 18

The inclusion of 18 timers allows for precise time-keeping and scheduling functionality in the microcontroller.

RAM Bytes: 6144

The generous RAM capacity of 6144 bytes supports efficient data storage and manipulation for complex algorithms and data processing tasks.

Technology: BIPOLAR

The bipolar technology used in the microcontroller provides high noise immunity and robustness in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting on the PCB surface.

Analog To Digital Convertors: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs enables precise analog signal conversion for accurate data acquisition.

Maximum Supply Current: 6.5 mA

The low maximum supply current of 6.5mA helps in saving power and extending battery life in portable applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources and voltage levels.

No. of DMA Channels: 3

Having 3 DMA channels allows for efficient data transfer and management, reducing the load on the CPU for improved system performance.

No. of Serial I/Os: 4

The presence of 4 serial I/Os enables communication with external devices and peripherals for data exchange.

PWM Channels: YES

The availability of PWM channels allows for precise control of motor speed, brightness, and other applications requiring variable duty cycles.

Connectivity: I2C, IRDA, SPI(2), UART

Support for multiple connectivity options like I2C, IRDA, SPI, and UART enables seamless communication with various devices and interfaces.

ROM Programmability: FLASH

ROM programmability using flash memory technology allows for easy and quick updates of firmware and program code.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm facilitates precise soldering and mounting on densely populated PCBs.

Format: FIXED POINT

Using fixed-point format simplifies mathematical calculations and improves computational efficiency in the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has moderate moisture sensitivity, ensuring proper handling and storage to prevent damage.

Speed: 25 rpm

The speed of 25 rpm is relevant for motor control applications and precise speed regulation.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption during idle or standby periods, extending battery life.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits enables storage of program instructions for efficient execution.

No. of I/O Lines: 31

Having 31 I/O lines allows for versatile connectivity and interfacing with external peripherals and devices.

Technical Specifications

Microcontrollers MSP430F5304IPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, CRC, DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5304IPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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