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MSP430F5257IZQER

Texas Instruments

MSP430F5257IZQER by Texas Instruments

MSP430F5257IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like RTC and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing up to 32 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,261 parts In-Stock

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Digiode

USA . 429 parts In-Stock

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429

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

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$10.796

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286

$10.796

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One Stop Electronics

USA . 1,584 parts In-Stock

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$32.000

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$32.000

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Parana Technologies

USA . 1,165 parts In-Stock

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$56.632

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$56.632

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$62.358

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1,532

$62.358

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ChromeModa Solutions

Germany . 1,432 parts In-Stock

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$63.631

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$52.177

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1,432

$63.631

$52.177

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IDEA Electronic Components Group

UK . 142 parts In-Stock

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$63.631

100+ parts

$60.449

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$57.268

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142

$63.631

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$57.268

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Component Stockers USA

USA . 302 parts In-Stock

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$99.990

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Corphita

USA . 1,592 parts In-Stock

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Microchip USA

USA . 222 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5257IZQER microcontroller! Dive into a world of endless possibilities as you explore the cutting-edge technology and precision engineering that Texas Instruments is renowned for. Perfect for a wide range of applications, this microcontroller offers unparalleled value, efficiency, and reliability. Get ready to revolutionize your projects and unleash your creativity with the MSP430F5257IZQER by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external damage.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can provide more power for processing tasks.

Bit Size: 16

16-bit architecture allows for more complex computations and operations.

No. of Terminals: 80

Provides a sufficient number of terminals for connecting to external devices and peripherals.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial use.

CPU Family: MSP430

MSP430 CPUs are known for their low power consumption and efficient performance.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of code and data.

Speed: 32 rpm

Provides fast processing speed for quick data manipulation and response times.

Technical Specifications

Microcontrollers MSP430F5257IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5257IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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