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MSP430F5256IZQER

Texas Instruments

MSP430F5256IZQER by Texas Instruments

MSP430F5256IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 54 I/O lines and connectivity via USCI(8) peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,528 parts In-Stock

1+ parts

-

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7,528

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Digiode

USA . 3,675 parts In-Stock

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-

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-

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3,675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$7.941

100+ parts

-

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228

$7.941

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One Stop Electronics

USA . 285 parts In-Stock

1+ parts

$35.000

100+ parts

-

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285

$35.000

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Parana Technologies

USA . 1,156 parts In-Stock

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$47.413

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1,156

$47.413

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ChromeModa Solutions

Germany . 3,779 parts In-Stock

1+ parts

$53.273

100+ parts

$43.684

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3,779

$53.273

$43.684

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IDEA Electronic Components Group

UK . 2,009 parts In-Stock

1+ parts

$53.273

100+ parts

$50.609

1k+ parts

$47.946

10k+ parts

-

2,009

$53.273

$50.609

$47.946

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

-

100+ parts

$48.031

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1,362

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$48.031

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Corphita

USA . 532 parts In-Stock

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532

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Microchip USA

USA . 248 parts In-Stock

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248

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5256IZQER microcontroller. Known for its reliable quality and cutting-edge technology, this device is a game-changer in the world of microcontrollers. Perfect for a wide range of applications, from IoT devices to industrial automation, this product offers unmatched performance and efficiency. Experience seamless connectivity and superior functionality with the MSP430F5256IZQER, designed to elevate your projects to new heights. Trust Texas Instruments to deliver excellence with every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package is durable and cost-effective, making this microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can operate effectively in various power supply scenarios.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and calculations, making this microcontroller suitable for complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures high performance with reduced instruction set computing, making it suitable for real-time applications.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast processing speed and responsiveness in handling tasks, making this microcontroller ideal for time-sensitive applications.

Connectivity: USCI(8)

With 8 USCI interfaces, this microcontroller offers versatile connectivity options for communication with external devices, enhancing its usability in interconnected systems.

Technical Specifications

Microcontrollers MSP430F5256IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5256IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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