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MSP430F5256IRGCR

Texas Instruments

MSP430F5256IRGCR by Texas Instruments

MSP430F5256IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 53 I/O lines and connectivity through USCI.

Median Price

$4.353

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 42,912 parts In-Stock

1+ parts

$4.353

100+ parts

$3.549

1k+ parts

$2.366

10k+ parts

-

42,912

$4.353

$3.549

$2.366

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,040 parts In-Stock

1+ parts

$4.135

100+ parts

-

1k+ parts

-

10k+ parts

-

4,040

$4.135

-

-

-

Vyrian

USA . 6,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,080

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,624 parts In-Stock

1+ parts

$3.918

100+ parts

-

1k+ parts

-

10k+ parts

-

3,624

$3.918

-

-

-

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$17.420

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$17.420

-

-

-

Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$68.849

100+ parts

-

1k+ parts

-

10k+ parts

-

2,317

$68.849

-

-

-

DigiPath Technology Company

USA . 768 parts In-Stock

1+ parts

$75.811

100+ parts

-

1k+ parts

-

10k+ parts

-

768

$75.811

-

-

-

ChromeModa Solutions

Germany . 3,659 parts In-Stock

1+ parts

$77.358

100+ parts

$63.434

1k+ parts

-

10k+ parts

-

3,659

$77.358

$63.434

-

-

IDEA Electronic Components Group

UK . 105 parts In-Stock

1+ parts

$77.358

100+ parts

$73.490

1k+ parts

$69.622

10k+ parts

-

105

$77.358

$73.490

$69.622

-

Overview

Unlock the power of innovation with the MSP430F5256IRGCR by Texas Instruments, a cutting-edge microcontroller that delivers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile chip is designed to meet the demands of a wide range of applications. With advanced features like DMA channels, ADC channels, and multiple peripherals, this microcontroller offers seamless connectivity and efficient data processing. Trust in Texas Instruments' reputation for quality and craftsmanship, and experience the value and benefits of the MSP430F5256IRGCR for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures a lightweight and durable package, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square shape makes it easier to align and mount the microcontroller on the circuit board.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and performance for demanding tasks.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options with other components in the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier and heat sink/slug style ensures efficient heat dissipation and compact design.

Minimum Supply Voltage: 2.4 V

Lower minimum supply voltage helps in conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables the microcontroller to function reliably in various environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 family, known for its low power consumption and high performance, this microcontroller is a reliable choice.

Technical Specifications

Microcontrollers MSP430F5256IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5256IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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