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MSP430F5254IZQE

Texas Instruments

MSP430F5254IZQE by Texas Instruments

MSP430F5254IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 32 RAM words. It operates at a max frequency of 32 MHz, suitable for industrial applications requiring up to 54 I/O lines and connectivity through USCI. The package style is grid array with very thin profile, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,399 parts In-Stock

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6,399

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Digiode

USA . 3,428 parts In-Stock

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3,428

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Distributors (Availability)

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One Stop Electronics

USA . 1,599 parts In-Stock

1+ parts

$2.000

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1,599

$2.000

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AZTECH Wire

Italy . 889 parts In-Stock

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$14.843

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889

$14.843

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Parana Technologies

USA . 1,553 parts In-Stock

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$36.562

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1,553

$36.562

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ChromeModa Solutions

Germany . 6,461 parts In-Stock

1+ parts

$41.081

100+ parts

$33.686

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6,461

$41.081

$33.686

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IDEA Electronic Components Group

UK . 771 parts In-Stock

1+ parts

$41.081

100+ parts

$39.027

1k+ parts

$36.973

10k+ parts

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771

$41.081

$39.027

$36.973

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Corphita

USA . 2,545 parts In-Stock

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2,545

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DigiPath Technology Company

USA . 2,308 parts In-Stock

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$37.039

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2,308

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$37.039

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Microchip USA

USA . 339 parts In-Stock

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339

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Overview

Unlock the power of innovation with the MSP430F5254IZQE by Texas Instruments. As a leading manufacturer in the field of microcontrollers, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, from industrial automation to consumer electronics. With its cutting-edge technology and advanced features, the MSP430F5254IZQE offers unparalleled value and benefits to customers. Experience seamless connectivity, high performance, and efficiency with this exceptional product. Choose Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the microcontroller components.

Surface Mount: YES

Makes it easy to integrate into electronic circuits, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various systems.

Bit Size: 16

Provides a good balance between processing power and efficiency for many applications.

No. of Terminals: 80

Offers plenty of I/O options for connecting to other components or peripherals.

RAM Bytes: 32768

Sufficient memory for storing data and executing tasks efficiently.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing speed and response time.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller without needing specialized equipment.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient and streamlined processing of instructions for improved performance.

Connectivity: USCI(8)

Multiple serial communication interfaces provide flexible connectivity options for interfacing with other devices.

Technical Specifications

Microcontrollers MSP430F5254IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5254IZQE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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