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MSP430F5253IZQER

Texas Instruments

MSP430F5253IZQER by Texas Instruments

Texas Instruments MSP430F5253IZQER is a CMOS microcontroller with 131072 ROM words. It can withstand peak reflow temperature of 260°C for up to 30s. Ideal for applications requiring RISC-based microcontrollers, such as IoT devices and embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,683 parts In-Stock

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8,683

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Digiode

USA . 3,664 parts In-Stock

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3,664

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Distributors (Availability)

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One Stop Electronics

USA . 1,241 parts In-Stock

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$12.000

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1,241

$12.000

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AZTECH Wire

Italy . 513 parts In-Stock

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$14.528

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513

$14.528

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Parana Technologies

USA . 1,928 parts In-Stock

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$28.638

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$49.862

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1,928

$28.638

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$49.862

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DigiPath Technology Company

USA . 2,163 parts In-Stock

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$31.534

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$29.012

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2,163

$31.534

$29.012

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ChromeModa Solutions

Germany . 3,233 parts In-Stock

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$32.178

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$26.386

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3,233

$32.178

$26.386

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

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$32.178

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$30.569

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$28.960

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1,047

$32.178

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$28.960

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Corphita

USA . 4,750 parts In-Stock

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4,750

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Microchip USA

USA . 224 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F5253IZQER microcontroller. With a reputation for excellence, Texas Instruments delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this microcontroller offers unmatched value, efficiency, and versatility. Whether you're working on IoT devices, wearables, or industrial automation, the MSP430F5253IZQER is the perfect choice to bring your ideas to life. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and durability for the microcontroller.

ROM Words: 131072

With a large ROM capacity of 131072 words, this microcontroller can store a significant amount of program data, allowing for complex and advanced functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds at peak temperature ensures efficient manufacturing processes and minimizes the risk of thermal damage to the microcontroller.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this microcontroller can withstand the soldering process involved in PCB assembly, ensuring robust mechanical connections.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller enables high performance computing and efficient instruction execution, making it suitable for applications requiring real-time processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this microcontroller has a moderate level of moisture sensitivity, allowing for safe and reliable storage and handling in typical manufacturing environments.

Technical Specifications

Microcontrollers MSP430F5253IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

ROM Words:

131072

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430F5253IZQER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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