Loading...

MSP430F5253IRGCT

Texas Instruments

MSP430F5253IRGCT by Texas Instruments

MSP430F5253IRGCT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like RTC and WDT. Ideal for industrial applications requiring a max clock frequency of 32 MHz in a compact square package.

Median Price

$6.147

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,750 parts In-Stock

1+ parts

$6.147

100+ parts

$5.012

1k+ parts

$3.341

10k+ parts

-

8,750

$6.147

$5.012

$3.341

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,176 parts In-Stock

1+ parts

$5.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$5.840

-

-

-

Vyrian

USA . 4,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,079

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,242 parts In-Stock

1+ parts

$5.532

100+ parts

-

1k+ parts

-

10k+ parts

-

4,242

$5.532

-

-

-

AZTECH Wire

Italy . 1,090 parts In-Stock

1+ parts

$12.860

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$12.860

-

-

-

Microchip USA

USA . 1,121 parts In-Stock

1+ parts

$30.750

100+ parts

$30.560

1k+ parts

$30.470

10k+ parts

$30.370

1,121

$30.750

$30.560

$30.470

$30.370

Parana Technologies

USA . 1,742 parts In-Stock

1+ parts

$39.644

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

$39.644

-

-

-

DigiPath Technology Company

USA . 432 parts In-Stock

1+ parts

$43.653

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$43.653

-

-

-

ChromeModa Solutions

Germany . 5,030 parts In-Stock

1+ parts

$44.544

100+ parts

$36.526

1k+ parts

-

10k+ parts

-

5,030

$44.544

$36.526

-

-

IDEA Electronic Components Group

UK . 1,676 parts In-Stock

1+ parts

$44.544

100+ parts

$42.317

1k+ parts

$40.090

10k+ parts

-

1,676

$44.544

$42.317

$40.090

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$46.896

100+ parts

$42.675

1k+ parts

$38.455

10k+ parts

-

2,000

$46.896

$42.675

$38.455

-

Lixinc

USA . 11,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,252

-

-

-

-

Component Stockers USA

USA . 8,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,763

-

-

-

-

iodParts Technologies Inc.

India . 6,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,300

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Perfect Parts

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Overview

Discover the Texas Instruments MSP430F5253IRGCT microcontroller, a cutting-edge solution for your electronic projects. With Texas Instruments' reputation for top-quality manufacturing, this device guarantees reliability and performance. Ideal for a wide range of applications, this microcontroller offers customers seamless connectivity, efficient power management, and advanced peripherals like ADC, DMA, and PWM channels. Unlock the full potential of your designs with the MSP430F5253IRGCT and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher operating voltage range, providing flexibility in different power supply configurations.

Bit Size: 16

16-bit architecture allows for more precision and complex calculations compared to lower bit microcontrollers.

ADC Channels: YES

Having Analog to Digital Converter channels allows for easy interfacing with analog sensors and signals.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing speeds and responsiveness in applications.

ROM Words: 131072

Large ROM size allows for storing a significant amount of program data and code.

Connectivity: USCI(8)

Multiple Universal Serial Communication Interfaces provide versatile connectivity options for external devices.

Technical Specifications

Microcontrollers MSP430F5253IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5253IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20