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MSP430F5253IRGCR

Texas Instruments

MSP430F5253IRGCR by Texas Instruments

MSP430F5253IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 12-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like RTC and timers. Ideal for industrial applications requiring a max clock frequency of 32 MHz in a compact chip carrier package.

Median Price

$3.814

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,995 parts In-Stock

1+ parts

$4.353

100+ parts

$3.549

1k+ parts

$2.366

10k+ parts

-

7,995

$4.353

$3.549

$2.366

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Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.274

6,000

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-

-

$3.274

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,751 parts In-Stock

1+ parts

$4.135

100+ parts

-

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1,751

$4.135

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Vyrian

USA . 2,129 parts In-Stock

1+ parts

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2,129

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,680 parts In-Stock

1+ parts

$3.918

100+ parts

-

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3,680

$3.918

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$17.920

100+ parts

-

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660

$17.920

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Parana Technologies

USA . 603 parts In-Stock

1+ parts

$67.978

100+ parts

-

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603

$67.978

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DigiPath Technology Company

USA . 1,603 parts In-Stock

1+ parts

$74.852

100+ parts

$68.864

1k+ parts

-

10k+ parts

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1,603

$74.852

$68.864

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ChromeModa Solutions

Germany . 2,250 parts In-Stock

1+ parts

$76.380

100+ parts

$62.632

1k+ parts

-

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2,250

$76.380

$62.632

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IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$76.380

100+ parts

$72.561

1k+ parts

$68.742

10k+ parts

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806

$76.380

$72.561

$68.742

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Lixinc

USA . 4,928 parts In-Stock

1+ parts

-

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4,928

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A-Z Elektronik GmbH

Germany . 1,460 parts In-Stock

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1,460

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5253IRGCR microcontroller. Designed with precision and quality in mind, this chip offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides advanced features such as ADC channels, DMA capabilities, and PWM channels, making it versatile and reliable. Trust in Texas Instruments' legacy of excellence and choose the MSP430F5253IRGCR for your next project. Experience the difference in quality and efficiency that this microcontroller brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers as it offers good insulation properties and is lightweight, making it suitable for portable devices.

Maximum Supply Voltage: 3.6 V

Having a high maximum supply voltage allows for flexibility in powering the microcontroller, making it compatible with a wide range of voltage sources.

Bit Size: 16

A 16-bit microcontroller can handle larger data sizes and perform more complex calculations compared to 8-bit microcontrollers, making it suitable for applications requiring higher processing power.

ROM Words: 131072

With a large ROM capacity, this microcontroller can store a significant amount of program code and data, allowing for versatile programming capabilities.

Maximum Clock Frequency: 32 MHz

A high clock frequency enables faster processing speeds, making this microcontroller suitable for applications requiring quick response times or real-time data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC (Reduced Instruction Set Computing) architecture simplifies the instruction set and enhances performance efficiency, making this microcontroller a good choice for applications demanding high speed and low power consumption.

Technical Specifications

Microcontrollers MSP430F5253IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5253IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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