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MSP430F5252IRGCT

Texas Instruments

MSP430F5252IRGCT by Texas Instruments

MSP430F5252IRGCT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring up to 53 I/O lines and connectivity via USCI(8) peripherals.

Median Price

$7.780

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$6.147

100+ parts

$5.012

1k+ parts

$3.341

10k+ parts

-

2,000

$6.147

$5.012

$3.341

-

Mouser Electronics

USA . 79 parts In-Stock

1+ parts

$7.780

100+ parts

$5.100

1k+ parts

$4.530

10k+ parts

-

79

$7.780

$5.100

$4.530

-

DigiKey

USA . 23 parts In-Stock

1+ parts

$7.780

100+ parts

$5.092

1k+ parts

$4.652

10k+ parts

$4.530

23

$7.780

$5.092

$4.652

$4.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,970 parts In-Stock

1+ parts

$5.368

100+ parts

-

1k+ parts

-

10k+ parts

-

2,970

$5.368

-

-

-

Vyrian

USA . 2,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,413

-

-

-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 557 parts In-Stock

1+ parts

$4.800

100+ parts

$4.680

1k+ parts

$4.656

10k+ parts

-

557

$4.800

$4.680

$4.656

-

Ampacity Inc.

Singapore . 485 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$4.800

-

-

-

Corphita

USA . 3,362 parts In-Stock

1+ parts

$5.085

100+ parts

-

1k+ parts

-

10k+ parts

-

3,362

$5.085

-

-

-

Parana Technologies

USA . 926 parts In-Stock

1+ parts

$25.823

100+ parts

-

1k+ parts

$26.426

10k+ parts

-

926

$25.823

-

$26.426

-

Microchip USA

USA . 2,485 parts In-Stock

1+ parts

$27.150

100+ parts

$26.980

1k+ parts

$26.890

10k+ parts

$26.810

2,485

$27.150

$26.980

$26.890

$26.810

DigiPath Technology Company

USA . 489 parts In-Stock

1+ parts

$28.435

100+ parts

$26.160

1k+ parts

-

10k+ parts

-

489

$28.435

$26.160

-

-

IDEA Electronic Components Group

UK . 690 parts In-Stock

1+ parts

$29.015

100+ parts

$27.564

1k+ parts

$26.114

10k+ parts

-

690

$29.015

$27.564

$26.114

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ChromeModa Solutions

Germany . 65 parts In-Stock

1+ parts

$29.015

100+ parts

$23.792

1k+ parts

-

10k+ parts

-

65

$29.015

$23.792

-

-

Corohmni

South Africa . 391 parts In-Stock

1+ parts

$49.291

100+ parts

-

1k+ parts

-

10k+ parts

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391

$49.291

-

-

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Continental Prestige Electronics

USA . 5,460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,460

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-

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Argo Parts USA

USA . 1,657 parts In-Stock

1+ parts

-

100+ parts

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1,657

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-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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450

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-

-

Overview

Discover the innovative MSP430F5252IRGCT microcontroller by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. Ideal for a wide range of applications, this powerful chip offers customers exceptional value with its advanced features and benefits. With a 16-bit architecture and extensive peripherals like comparators, timers, and DMA channels, this product provides unmatched performance and versatility. Whether you're designing IoT devices, industrial controls, or consumer electronics, the MSP430F5252IRGCT delivers the power and efficiency you need to bring your projects to life. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and convenient assembly onto a circuit board, saving time and effort.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power options for various applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

Bit Size: 16

16-bit architecture enables the microcontroller to handle more complex algorithms and computations.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity and integration with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide flexibility in design and installation options based on specific needs.

Minimum Supply Voltage: 2.4 V

Lower minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environments.

CPU Family: MSP430

Being part of the MSP430 family means the microcontroller benefits from a well-established and trusted line of products.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances the terminals' conductivity and corrosion resistance for better reliability.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU overhead for optimized performance.

Terminal Position: QUAD

Quad terminal position offers a good balance between compactness and ease of soldering during assembly.

ROM Words: 131072

Large ROM capacity allows for storing more program instructions and data for complex applications.

Maximum Seated Height: 1 mm

Low seated height contributes to a slim profile and space-saving design for compact applications.

RAM Words: 16

Having 16 RAM words provides enough memory for data storage and temporary calculations during operation.

Width: 9 mm

Compact width dimension makes the microcontroller suitable for space-constrained designs.

Peripherals: COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

The presence of multiple peripherals offers enhanced functionality and versatility for various applications.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing speed and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

30-second reflow time at peak temperature ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures solder joints are properly formed for solid connections.

Length: 9 mm

Compact length dimension makes the microcontroller suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and low power consumption.

RAM Bytes: 16384

Having a large RAM capacity enables efficient data handling and processing for complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly and enhances reliability by reducing the risk of solder joint fatigue.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse width modulation channels enable precise control of analog peripherals and outputs.

Connectivity: USCI(8)

Multiple USCI interfaces provide versatile connectivity options for external communication and integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs, improving circuit board layout efficiency.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller can withstand limited exposure to moisture during storage and operation.

Speed: 32 rpm

High processing speed of 32 RPM enables quick execution of tasks and real-time responsiveness.

On Chip Program ROM Width: 8

Having an 8-bit on-chip ROM width allows for efficient memory usage and storage of program instructions.

No. of I/O Lines: 53

Having 53 I/O lines offers versatile connectivity and interfacing capabilities with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5252IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(8)

Peripherals:

COMPARATOR(3), DMA(3), RTC, TIMER(5), WDT

Trade Compliance

MSP430F5252IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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