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MSP430F5249IRGCT

Texas Instruments

MSP430F5249IRGCT by Texas Instruments

MSP430F5249IRGCT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications due to its low power mode, it offers connectivity through IRDA, I2C, SPI(2), UART interfaces.

Median Price

$5.509

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,750 parts In-Stock

1+ parts

$5.509

100+ parts

$4.491

1k+ parts

$2.994

10k+ parts

-

25,750

$5.509

$4.491

$2.994

-

DigiKey

USA . 449 parts In-Stock

1+ parts

$7.040

100+ parts

$4.583

1k+ parts

$4.372

10k+ parts

-

449

$7.040

$4.583

$4.372

-

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.026

10k+ parts

$3.814

250

-

-

$4.026

$3.814

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,417 parts In-Stock

1+ parts

$5.234

100+ parts

-

1k+ parts

-

10k+ parts

-

4,417

$5.234

-

-

-

Vyrian

USA . 6,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,257

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,909 parts In-Stock

1+ parts

$4.958

100+ parts

-

1k+ parts

-

10k+ parts

-

4,909

$4.958

-

-

-

Parana Technologies

USA . 2,327 parts In-Stock

1+ parts

$36.139

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

$36.139

-

-

-

ChromeModa Solutions

Germany . 3,421 parts In-Stock

1+ parts

$40.606

100+ parts

$33.297

1k+ parts

-

10k+ parts

-

3,421

$40.606

$33.297

-

-

IDEA Electronic Components Group

UK . 253 parts In-Stock

1+ parts

$40.606

100+ parts

$38.576

1k+ parts

$36.545

10k+ parts

-

253

$40.606

$38.576

$36.545

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DigiPath Technology Company

USA . 926 parts In-Stock

1+ parts

-

100+ parts

$36.610

1k+ parts

-

10k+ parts

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926

-

$36.610

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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Lixinc

USA . 361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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361

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5249IRGCT microcontroller! Crafted with precision and expertise, this device offers cutting-edge technology for a wide range of applications. With its innovative features and superior performance, customers can experience unmatched value and benefits that will take their projects to new heights. Trust in Texas Instruments to deliver quality and reliability in every chip, making the MSP430F5249IRGCT a top choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable and cost-effective material for packaging, ensuring the product is long-lasting and affordable.

Bit Size: 16

16-bit architecture provides enhanced performance and computational capabilities compared to lower bit sizes.

No. of Terminals: 64

Ample number of terminals for connectivity and expansion options, offering flexibility in designing applications.

CPU Family: MSP430

MSP430 family is known for low power consumption and high efficiency, making this microcontroller suitable for battery-powered devices.

ADC Channels: YES

Built-in Analog-to-Digital Converters enable the microcontroller to interface with analog sensors and signals for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and optimized processing, making it suitable for real-time applications.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast data processing and high-speed operation, ideal for time-critical applications.

RAM Bytes: 8192

Sufficient RAM capacity for storing and processing data, ensuring smooth operation of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5249IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5249IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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