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MSP430F5244IRGZT

Texas Instruments

MSP430F5244IRGZT by Texas Instruments

MSP430F5244IRGZT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 10-Ch 10-Bit ADC channels, and 3 DMA channels. It is ideal for industrial applications requiring low power consumption, featuring peripherals like BOR, CRC, and PWM. With a max clock frequency of 32 MHz, it offers connectivity options such as IRDA, I2C, and UART.

Median Price

$6.900

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,240 parts In-Stock

1+ parts

$5.388

100+ parts

$4.392

1k+ parts

$2.928

10k+ parts

-

18,240

$5.388

$4.392

$2.928

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Mouser Electronics

USA . 423 parts In-Stock

1+ parts

$6.900

100+ parts

$4.490

1k+ parts

$4.130

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-

423

$6.900

$4.490

$4.130

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DigiKey

USA . 422 parts In-Stock

1+ parts

$6.900

100+ parts

$4.486

1k+ parts

$4.279

10k+ parts

-

422

$6.900

$4.486

$4.279

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$4.992

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-

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15

$4.992

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Digiode

USA . 3,658 parts In-Stock

1+ parts

$5.119

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3,658

$5.119

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Vyrian

USA . 5,181 parts In-Stock

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5,181

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Semi Source

USA . 958 parts In-Stock

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958

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Connect4Technologies Inc.

Canada . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,335 parts In-Stock

1+ parts

$4.580

100+ parts

-

1k+ parts

-

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6,335

$4.580

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Corphita

USA . 3,502 parts In-Stock

1+ parts

$4.849

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3,502

$4.849

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.892

100+ parts

-

1k+ parts

$4.697

10k+ parts

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2,000

$4.892

-

$4.697

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Continental Prestige Electronics

USA . 2,486 parts In-Stock

1+ parts

$4.992

100+ parts

-

1k+ parts

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10k+ parts

$4.892

2,486

$4.992

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-

$4.892

Parana Technologies

USA . 924 parts In-Stock

1+ parts

$71.463

100+ parts

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924

$71.463

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DigiPath Technology Company

USA . 2,222 parts In-Stock

1+ parts

$78.690

100+ parts

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2,222

$78.690

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ChromeModa Solutions

Germany . 4,731 parts In-Stock

1+ parts

$80.296

100+ parts

$65.843

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4,731

$80.296

$65.843

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IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$80.296

100+ parts

$76.281

1k+ parts

$72.266

10k+ parts

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111

$80.296

$76.281

$72.266

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,237 parts In-Stock

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2,237

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5244IRGZT Microcontroller, a cutting-edge solution for a wide range of applications. Renowned for their high-quality products, Texas Instruments delivers unmatched reliability and performance. This versatile microcontroller offers customers unparalleled value with its advanced features, low power consumption, and flexible connectivity options. Whether you're designing IoT devices, consumer electronics, or industrial control systems, the MSP430F5244IRGZT is the perfect choice to bring your ideas to life. Elevate your projects with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it energy efficient.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance with reduced power consumption, enhancing overall efficiency.

ROM Programmability: FLASH

Flash ROM allows for easy and fast programming of the microcontroller, enabling quick changes and updates.

Analog To Digital Convertors: 10-Ch 10-Bit

Multiple ADC channels with high resolution allow for precise analog to digital conversion, ideal for sensor applications.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options such as IRDA, I2C, SPI, and UART enable versatile communication with other devices.

ROM Words: 131072

Large ROM capacity of 131072 words provides ample space for program storage and data handling.

RAM Bytes: 8192

Sufficient RAM capacity of 8192 bytes allows for efficient data processing and storage.

Speed: 25 rpm

High speed of 25 rpm enables fast processing and response times, suitable for real-time applications.

Technical Specifications

Microcontrollers MSP430F5244IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430F5244IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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