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MSP430F5239IZQER

Texas Instruments

MSP430F5239IZQER by Texas Instruments

MSP430F5239IZQER by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,815 parts In-Stock

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Digiode

USA . 727 parts In-Stock

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AZTECH Wire

Italy . 478 parts In-Stock

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$14.372

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Parana Technologies

USA . 2,135 parts In-Stock

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$22.213

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$22.867

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DigiPath Technology Company

USA . 1,170 parts In-Stock

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$24.459

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$22.502

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ChromeModa Solutions

Germany . 3,902 parts In-Stock

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$24.958

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$20.466

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IDEA Electronic Components Group

UK . 1,220 parts In-Stock

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$24.958

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$23.710

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$22.462

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One Stop Electronics

USA . 1,192 parts In-Stock

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$31.000

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Component Stockers USA

USA . 509 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Experience unparalleled performance and reliability with the Texas Instruments MSP430F5239IZQER microcontroller. As a leader in the industry, Texas Instruments delivers top-notch quality products that cater to a wide range of applications. This microcontroller offers exceptional value to customers with its advanced features, low power consumption, and high-speed processing capabilities. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F5239IZQER is the perfect choice for your project. Upgrade your designs today and unlock endless possibilities with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body.

Maximum Supply Voltage: 3.6 V

Allows for a wide operating voltage range.

Bit Size: 16

Offers a good balance between performance and power consumption.

CPU Family: MSP430

Known for low power consumption and high performance, ideal for battery-powered applications.

ADC Channels: YES

Enables analog to digital conversion, essential for many applications.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

ROM Words: 131072

Sufficient memory for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing architecture for efficient performance.

RAM Bytes: 8192

Adequate random access memory for intermediate storage of data during operations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption.

Connectivity: IRDA, I2C, SPI(2), UART

Supports multiple communication interfaces for versatile connectivity.

Low Power Mode: YES

Enables power-saving features for extended battery life.

Technical Specifications

Microcontrollers MSP430F5239IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5239IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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