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MSP430F5239IZQE

Texas Instruments

MSP430F5239IZQE by Texas Instruments

MSP430F5239IZQE by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It operates b/w -40 to 85 °C, offering low power mode and peripherals like PWM, RTC, and WDT. Ideal for industrial applications requiring high-speed connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,658 parts In-Stock

1+ parts

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4,658

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Vyrian

USA . 3,416 parts In-Stock

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-

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3,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$14.686

100+ parts

-

1k+ parts

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657

$14.686

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Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

$31.785

100+ parts

-

1k+ parts

$89.106

10k+ parts

-

1,895

$31.785

-

$89.106

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One Stop Electronics

USA . 1,350 parts In-Stock

1+ parts

$35.000

100+ parts

-

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1,350

$35.000

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ChromeModa Solutions

Germany . 6,835 parts In-Stock

1+ parts

$35.714

100+ parts

$29.285

1k+ parts

-

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6,835

$35.714

$29.285

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IDEA Electronic Components Group

UK . 1,102 parts In-Stock

1+ parts

$35.714

100+ parts

$33.928

1k+ parts

$32.143

10k+ parts

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1,102

$35.714

$33.928

$32.143

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Corphita

USA . 2,442 parts In-Stock

1+ parts

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2,442

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DigiPath Technology Company

USA . 553 parts In-Stock

1+ parts

-

100+ parts

$32.200

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553

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$32.200

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Microchip USA

USA . 165 parts In-Stock

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165

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Overview

Unlock the power of innovation with the MSP430F5239IZQE by Texas Instruments. This high-quality microcontroller offers a wide range of applications in various industries, providing unparalleled value and benefits to customers. With advanced technology and reliable performance, this product stands out among its competitors. Experience superior connectivity, low power modes, and versatile peripherals, making it the ideal choice for your next project. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

A 16-bit microcontroller offers enhanced processing capabilities and better performance compared to 8-bit options.

No. of External Interrupts: 16

Having 16 external interrupts allows for efficient handling of multiple external events without missing any critical signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution, making the microcontroller suitable for real-time processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Multiple connectivity options make the microcontroller versatile and suitable for a wide range of communication protocols and interfaces.

Technical Specifications

Microcontrollers MSP430F5239IZQE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

COMPARATOR(8), DMA(3), PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5239IZQE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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