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MSP430F5239IRGCT

Texas Instruments

MSP430F5239IRGCT by Texas Instruments

MSP430F5239IRGCT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT.

Median Price

$5.644

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,200 parts In-Stock

1+ parts

$5.644

100+ parts

$4.945

1k+ parts

$2.794

10k+ parts

-

2,200

$5.644

$4.945

$2.794

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 786 parts In-Stock

1+ parts

$5.362

100+ parts

-

1k+ parts

-

10k+ parts

-

786

$5.362

-

-

-

Vyrian

USA . 5,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,228

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 402 parts In-Stock

1+ parts

$5.080

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$5.080

-

-

-

AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$10.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,054

$10.330

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Microchip USA

USA . 2,287 parts In-Stock

1+ parts

$26.250

100+ parts

$26.090

1k+ parts

$26.010

10k+ parts

$25.930

2,287

$26.250

$26.090

$26.010

$25.930

Parana Technologies

USA . 1,159 parts In-Stock

1+ parts

$34.042

100+ parts

-

1k+ parts

$139.992

10k+ parts

-

1,159

$34.042

-

$139.992

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ChromeModa Solutions

Germany . 4,078 parts In-Stock

1+ parts

$38.250

100+ parts

$31.365

1k+ parts

-

10k+ parts

-

4,078

$38.250

$31.365

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IDEA Electronic Components Group

UK . 1,795 parts In-Stock

1+ parts

$38.250

100+ parts

$36.338

1k+ parts

$34.425

10k+ parts

-

1,795

$38.250

$36.338

$34.425

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Advanced Electronics

New Zealand . 86 parts In-Stock

1+ parts

$64.629

100+ parts

$58.812

1k+ parts

$52.996

10k+ parts

-

86

$64.629

$58.812

$52.996

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QUARKTWIN TECHNOLOGY LTD

USA . 16,317 parts In-Stock

1+ parts

-

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16,317

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iodParts Technologies Inc.

India . 3,600 parts In-Stock

1+ parts

-

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3,600

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DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

-

100+ parts

$34.486

1k+ parts

-

10k+ parts

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1,176

-

$34.486

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Overview

Unlock the power of innovation with the MSP430F5239IRGCT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers like this one, perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile chip offers unparalleled performance and reliability. With features like low power consumption and high-speed processing, customers can trust in the value and benefits this product brings to their projects. Upgrade your designs today with the MSP430F5239IRGCT and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various power sources.

No. of External Interrupts: 16

Provides ample functionality for handling external events and improving system responsiveness.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing speeds and high-performance computing tasks.

RAM Bytes: 8192

Sufficient RAM capacity for storing and manipulating data during program execution, enhancing overall system efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and reduced power consumption, making it suitable for low-power applications.

ROM Programmability: FLASH

Flash ROM allows for in-system programmability, enabling easy updates and modifications to the program code.

Low Power Mode: YES

Supports low-power modes for energy-efficient operations, extending battery life in portable devices.

Technical Specifications

Microcontrollers MSP430F5239IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5239IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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