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MSP430F5239IRGCR

Texas Instruments

MSP430F5239IRGCR by Texas Instruments

MSP430F5239IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 53 I/O lines. It operates at a max clock frequency of 32 MHz and features peripherals like BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT. Ideal for industrial applications requiring low power consumption and connectivity via IRDA, I2C, SPI(2), UART interfaces.

Median Price

$3.998

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,976 parts In-Stock

1+ parts

$3.998

100+ parts

$3.503

1k+ parts

$1.979

10k+ parts

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10,976

$3.998

$3.503

$1.979

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,858 parts In-Stock

1+ parts

$3.798

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-

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4,858

$3.798

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Vyrian

USA . 7,161 parts In-Stock

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7,161

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,651 parts In-Stock

1+ parts

$3.598

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-

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4,651

$3.598

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AZTECH Wire

Italy . 1,036 parts In-Stock

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$11.710

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1,036

$11.710

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Parana Technologies

USA . 2,313 parts In-Stock

1+ parts

$38.790

100+ parts

$3,602.218

1k+ parts

$34.911

10k+ parts

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2,313

$38.790

$3,602.218

$34.911

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DigiPath Technology Company

USA . 1,366 parts In-Stock

1+ parts

$42.712

100+ parts

$39.295

1k+ parts

-

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1,366

$42.712

$39.295

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

1+ parts

$43.584

100+ parts

$41.405

1k+ parts

$39.226

10k+ parts

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1,681

$43.584

$41.405

$39.226

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ChromeModa Solutions

Germany . 14 parts In-Stock

1+ parts

$43.584

100+ parts

$35.739

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14

$43.584

$35.739

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Component Stockers USA

USA . 1,782 parts In-Stock

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1,782

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Overview

Unlock the power of innovation with the MSP430F5239IRGCR by Texas Instruments. Built with precision and expertise, this microcontroller offers unparalleled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile chip excels in delivering high performance while consuming minimal power. With advanced features like DMA channels, PWM capabilities, and multiple connectivity options, the MSP430F5239IRGCR is designed to enhance your products and elevate your projects to new heights. Experience the value and benefits of choosing Texas Instruments for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost-effectiveness and durability, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and can accommodate various voltage requirements in different applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller a reliable choice for energy-efficient applications.

ROM Words: 131072

With a large ROM capacity, this microcontroller can store a significant amount of program data, enabling complex functionality and programmability.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency allows for fast processing speeds, making the microcontroller suitable for applications that require quick response times.

RAM Bytes: 8192

The ample RAM capacity provides sufficient memory for data storage and processing, facilitating the execution of multiple tasks efficiently.

Connectivity: IRDA, I2C, SPI(2), UART

The multiple connectivity options offered by this microcontroller make it versatile and compatible with a wide range of communication protocols, enhancing its connectivity capabilities.

Technical Specifications

Microcontrollers MSP430F5239IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5239IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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