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MSP430F5237IZQER

Texas Instruments

MSP430F5237IZQER by Texas Instruments

MSP430F5237IZQER by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. It features ADC and DMA channels, along with BOR, CRC, PWM, RTC, and WDT peripherals. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,350 parts In-Stock

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Digiode

USA . 2,510 parts In-Stock

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2,510

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Distributors (Availability)

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$15.700

100+ parts

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381

$15.700

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One Stop Electronics

USA . 301 parts In-Stock

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$31.000

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301

$31.000

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Parana Technologies

USA . 761 parts In-Stock

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$34.058

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$140.493

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761

$34.058

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$140.493

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DigiPath Technology Company

USA . 407 parts In-Stock

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$37.502

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$34.502

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407

$37.502

$34.502

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ChromeModa Solutions

Germany . 1,754 parts In-Stock

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$38.267

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$31.379

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1,754

$38.267

$31.379

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$38.267

100+ parts

$36.354

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$34.440

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188

$38.267

$36.354

$34.440

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Corphita

USA . 2,863 parts In-Stock

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Microchip USA

USA . 258 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5237IZQER microcontroller! Known for its superior quality and reliability, Texas Instruments has crafted a game-changing device that is perfect for a wide range of applications. Whether you're looking to enhance your IoT devices, streamline industrial automation, or create innovative wearable technology, this microcontroller offers unmatched value, efficiency, and performance. Trust Texas Instruments to deliver cutting-edge solutions that empower your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, ideal for portable devices or applications where weight is a concern.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources, providing flexibility in different application scenarios.

CPU Family: MSP430

The use of MSP430 CPU family ensures high-performance and efficiency, making it a reliable choice for various embedded applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors or devices, expanding its capabilities in data acquisition and processing.

Peripherals: BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

The wide range of peripherals such as Brown-Out Reset, CRC, DMA, PWM, Real-Time Clock, Timer, and Watchdog Timer enhance the functionality and versatility of the microcontroller for different applications.

ROM Programmability: FLASH

The ROM programmability using FLASH technology enables easy and quick reprogramming of the microcontroller, allowing for efficient development and debugging of code.

Connectivity: IRDA, I2C, SPI(2), UART

The multiple connectivity options including IRDA, I2C, SPI, and UART enable seamless communication with other devices or systems, enhancing the interoperability of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5237IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

53

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5237IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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