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MSP430F5232IRGZR

Texas Instruments

MSP430F5232IRGZR by Texas Instruments

MSP430F5232IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 37 I/O lines, DMA and PWM channels, and connectivity options like IRDA, I2C, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.131

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 51,309 parts In-Stock

1+ parts

$3.131

100+ parts

$2.744

1k+ parts

$1.550

10k+ parts

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51,309

$3.131

$2.744

$1.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,160 parts In-Stock

1+ parts

$2.974

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4,160

$2.974

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Vyrian

USA . 2,456 parts In-Stock

1+ parts

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2,456

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Chip Stock

USA . 377 parts In-Stock

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377

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Distributors (Availability)

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Corphita

USA . 2,648 parts In-Stock

1+ parts

$2.818

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-

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2,648

$2.818

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AZTECH Wire

Italy . 951 parts In-Stock

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$8.780

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951

$8.780

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Parana Technologies

USA . 672 parts In-Stock

1+ parts

$27.065

100+ parts

-

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$31.826

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672

$27.065

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$31.826

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ChromeModa Solutions

Germany . 5,594 parts In-Stock

1+ parts

$30.410

100+ parts

$24.936

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5,594

$30.410

$24.936

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IDEA Electronic Components Group

UK . 321 parts In-Stock

1+ parts

$30.410

100+ parts

$28.890

1k+ parts

$27.369

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321

$30.410

$28.890

$27.369

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Lixinc

USA . 15,870 parts In-Stock

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DigiPath Technology Company

USA . 1,694 parts In-Stock

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$27.418

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1,694

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5232IRGZR microcontroller. Designed for high performance and reliability, this versatile chip is perfect for a wide range of applications. From industrial automation to consumer electronics, the MSP430F5232IRGZR offers unparalleled value, efficiency, and flexibility. With advanced features such as integrated peripherals and low power modes, this microcontroller is a game-changer for your next project. Trust in Texas Instruments' reputation for quality and experience the benefits of cutting-edge technology with the MSP430F5232IRGZR.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage : 3.6 V

The high maximum supply voltage allows flexibility in the power supply options for the microcontroller.

Bit Size : 16

The 16-bit architecture allows for more complex calculations and processing capabilities compared to lower bit sizes.

ADC Channels : YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

RAM Bytes : 8192

With 8192 bytes of RAM, the microcontroller has sufficient memory for storing and manipulating data during operation.

Maximum Clock Frequency : 32 MHz

The high clock frequency allows for fast and efficient operation of the microcontroller, suitable for real-time applications.

Peripheral IC Type : MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and reduced power consumption for better performance.

Connectivity : IRDA, I2C, SPI(2), UART

The multiple connectivity options make it versatile and compatible with a wide range of devices and communication protocols.

Technical Specifications

Microcontrollers MSP430F5232IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, CRC, DMA(3), POR, PWM, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5232IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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