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MSP430F5229IZQER

Texas Instruments

MSP430F5229IZQER by Texas Instruments

MSP430F5229IZQER by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at a max frequency of 32 MHz. It features 8KB RAM and Flash ROM programmability, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SCI(3), SPI(2), UART interfaces.

Median Price

$2.756

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,100 parts In-Stock

1+ parts

-

100+ parts

$2.600

1k+ parts

$2.330

10k+ parts

$2.190

6,100

-

$2.600

$2.330

$2.190

Verical

USA . 6,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.913

10k+ parts

$2.737

6,100

-

-

$2.913

$2.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 353 parts In-Stock

1+ parts

$2.746

100+ parts

-

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353

$2.746

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Vyrian

USA . 7,519 parts In-Stock

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7,519

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DigiKey Marketplace

USA . 6,100 parts In-Stock

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6,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 783 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

-

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783

$2.601

-

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Component Stockers USA

USA . 11,798 parts In-Stock

1+ parts

$2.980

100+ parts

$2.810

1k+ parts

$2.530

10k+ parts

-

11,798

$2.980

$2.810

$2.530

-

Parana Technologies

USA . 204 parts In-Stock

1+ parts

$73.835

100+ parts

-

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204

$73.835

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ChromeModa Solutions

Germany . 5,791 parts In-Stock

1+ parts

$82.961

100+ parts

$68.028

1k+ parts

-

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5,791

$82.961

$68.028

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$82.961

100+ parts

$78.813

1k+ parts

$74.665

10k+ parts

-

1,208

$82.961

$78.813

$74.665

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Perfect Parts

USA . 13,922 parts In-Stock

1+ parts

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13,922

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QUARKTWIN TECHNOLOGY LTD

USA . 12,489 parts In-Stock

1+ parts

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12,489

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Microchip USA

USA . 3,189 parts In-Stock

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3,189

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DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

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100+ parts

$74.798

1k+ parts

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10k+ parts

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2,347

-

$74.798

-

-

Overview

Experience the cutting-edge innovation and reliability of Texas Instruments with the MSP430F5229IZQER microcontroller. Perfect for a wide range of applications, this powerful device offers unmatched value and benefits to customers. With advanced features like multiple ADC channels, DMA channels, and PWM channels, along with connectivity options such as I2C, IRDA, SCI, SPI, and UART, this microcontroller is a versatile solution for your project needs. Trust in Texas Instruments for top-quality components that deliver superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle power inputs efficiently without risking damage.

On Chip Data RAM Width: 8

Wide on-chip data RAM width enables efficient data processing and storage capabilities for various applications.

Package Shape: SQUARE

The square package shape allows for easy placement on a PCB and efficient use of space within the design.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for faster and more complex calculations and operations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in powering the microcontroller according to the application requirements.

No. of Terminals: 80

A high number of terminals allow for a greater number of connectivity options and peripherals to be integrated with the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enhances thermal performance and allows for high-density mounting on the PCB.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even with low-power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it suitable for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent solderability and conductivity for reliable connections.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion for interfacing with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing, optimizing space and improving signal integrity.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program and data, making the microcontroller suitable for complex applications.

Maximum Seated Height: 1 mm

The low seated height of the package saves space on the PCB and allows for compact designs in space-constrained applications.

RAM Words: 8

The on-chip RAM words provide fast and efficient data storage and access for temporary variables and buffers.

Width: 5 mm

Compact width dimensions enable the microcontroller to be used in small form factor devices and space-constrained designs.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during production and maintenance phases.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast processing speed and real-time operation for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for reflow soldering at peak temperature ensures reliable and efficient assembly of the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller can withstand the reflow soldering process without damage.

Length: 5 mm

Compact length dimensions allow for space-efficient placement on the PCB and integration into small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of a RISC architecture in the microcontroller ensures high performance, low power consumption, and efficient instruction execution.

No. of Timers: 18

Multiple timers provide precise timing and control functions, essential for applications requiring accurate schedule and synchronization.

RAM Bytes: 8192

The generous amount of on-chip RAM bytes enables efficient data storage and processing, enhancing the microcontroller's performance in multitasking scenarios.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connections, especially in applications prone to mechanical stress and vibration.

Maximum Supply Current: 11 mA

Low maximum supply current consumption ensures energy efficiency and extended battery life in portable and battery-powered devices.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the microcontroller across various operating conditions.

No. of DMA Channels: 3

Multiple DMA channels enable parallel data transfer between peripherals and memory, reducing CPU overhead and improving system performance.

No. of Serial I/Os: 2

Built-in serial I/Os provide communication interfaces for connecting external devices, expanding the microcontroller's connectivity options.

PWM Channels: YES

Pulse Width Modulation (PWM) channels support precise control of analog signals, making the microcontroller suitable for applications like motor control and power management.

Connectivity: "I2C, IRDA, SCI(3), SPI(2), UART

Multiple connectivity options allow for versatile communication with various devices and peripherals, enhancing the microcontroller's interoperability in diverse applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and efficient programming of the microcontroller, allowing for code updates and modifications during development and production.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting of the microcontroller on the PCB, optimizing space utilization and layout efficiency.

Format: FIXED POINT

Fixed-point format simplifies numerical calculations and enhances processing speed, making the microcontroller suitable for applications requiring real-time processing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller has a moderate level of sensitivity to moisture exposure during handling and storage.

Speed: 25 rpm

The specified speed of 25 rpm may relate to a motor control application, where the microcontroller can accurately regulate the rotational speed for precise control.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during idle periods, extending battery life in battery-powered applications.

On Chip Program ROM Width: 8

Wide on-chip program ROM width enables efficient storage of program instructions, enhancing code execution speed and efficiency.

No. of I/O Lines: 53

A high number of I/O lines provide ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile in its applications.

Technical Specifications

Microcontrollers MSP430F5229IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5229IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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