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MSP430F5229IYFFT

Texas Instruments

MSP430F5229IYFFT by Texas Instruments

MSP430F5229IYFFT by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 32 MHz max clock frequency, and 3.6 V max supply voltage. Ideal for industrial applications, it features 18 timers, I2C, IRDA, SCI(3), SPI(2), UART connectivity options, and low power mode for efficient operation.

Median Price

$6.964

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,450 parts In-Stock

1+ parts

$6.147

100+ parts

$5.012

1k+ parts

$3.341

10k+ parts

-

1,450

$6.147

$5.012

$3.341

-

DigiKey

USA . 70 parts In-Stock

1+ parts

$7.780

100+ parts

$5.576

1k+ parts

$4.861

10k+ parts

-

70

$7.780

$5.576

$4.861

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 164 parts In-Stock

1+ parts

$5.840

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$5.840

-

-

-

Vyrian

USA . 7,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,310

-

-

-

-

ComSIT Distribution GmbH

Germany . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,062 parts In-Stock

1+ parts

$5.532

100+ parts

-

1k+ parts

-

10k+ parts

-

3,062

$5.532

-

-

-

Microchip USA

USA . 2,837 parts In-Stock

1+ parts

$16.060

100+ parts

$15.830

1k+ parts

$15.720

10k+ parts

$15.600

2,837

$16.060

$15.830

$15.720

$15.600

Parana Technologies

USA . 2,118 parts In-Stock

1+ parts

$46.870

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$46.870

-

-

-

DigiPath Technology Company

USA . 1,546 parts In-Stock

1+ parts

$51.610

100+ parts

$47.481

1k+ parts

-

10k+ parts

-

1,546

$51.610

$47.481

-

-

ChromeModa Solutions

Germany . 2,626 parts In-Stock

1+ parts

$52.663

100+ parts

$43.184

1k+ parts

-

10k+ parts

-

2,626

$52.663

$43.184

-

-

IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$52.663

100+ parts

$50.030

1k+ parts

$47.397

10k+ parts

-

670

$52.663

$50.030

$47.397

-

Perfect Parts

USA . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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263

-

-

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5229IYFFT microcontroller. Trusted by industry leaders, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, the MSP430F5229IYFFT delivers unmatched value with its low power consumption, advanced features, and seamless connectivity options. Embrace innovation and take your projects to the next level with this versatile microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount feature makes installation and assembly of the product easier and more efficient.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, enhancing versatility in various applications.

On Chip Data RAM Width: 8

8-bit width for on-chip data RAM ensures efficient data handling and processing capabilities.

Package Shape: RECTANGULAR

Rectangular package shape provides compactness and ease of PCB layout design.

Bit Size: 16

16-bit architecture offers higher processing capabilities and performance.

Power Supplies (V): 2/3.3

Support for both 2V and 3.3V power supplies provides flexibility in power input options.

No. of Terminals: 64

64 terminals allow for multiple connections and interfaces, expanding connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array packaging with thin profile and fine pitch enhances space efficiency and reliability.

Minimum Supply Voltage: 2.4 V

With a minimum supply voltage of 2.4V, the product can operate efficiently at lower power levels.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures up to 85°C ensures reliability in harsh environments.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it a popular choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The product can operate in extreme cold conditions down to -40°C, suitable for diverse environmental settings.

Technical Specifications

Microcontrollers MSP430F5229IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

3.535 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.415 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5229IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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