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MSP430F5229IRGCT

Texas Instruments

MSP430F5229IRGCT by Texas Instruments

MSP430F5229IRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8KB RAM, FLASH ROM programmability, and connectivity options like I2C, IRDA, SCI(3), SPI(2), UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$6.964

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,200 parts In-Stock

1+ parts

$6.147

100+ parts

$5.012

1k+ parts

$3.341

10k+ parts

-

1,200

$6.147

$5.012

$3.341

-

DigiKey

USA . 455 parts In-Stock

1+ parts

$7.780

100+ parts

$5.092

1k+ parts

$4.861

10k+ parts

-

455

$7.780

$5.092

$4.861

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,766 parts In-Stock

1+ parts

$5.840

100+ parts

-

1k+ parts

-

10k+ parts

-

2,766

$5.840

-

-

-

Vyrian

USA . 4,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,942

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,999 parts In-Stock

1+ parts

$5.532

100+ parts

-

1k+ parts

-

10k+ parts

-

1,999

$5.532

-

-

-

Microchip USA

USA . 2,387 parts In-Stock

1+ parts

$16.060

100+ parts

$15.830

1k+ parts

$15.720

10k+ parts

$15.600

2,387

$16.060

$15.830

$15.720

$15.600

Parana Technologies

USA . 32 parts In-Stock

1+ parts

$22.034

100+ parts

-

1k+ parts

$22.590

10k+ parts

-

32

$22.034

-

$22.590

-

ChromeModa Solutions

Germany . 1,779 parts In-Stock

1+ parts

$24.757

100+ parts

$20.301

1k+ parts

-

10k+ parts

-

1,779

$24.757

$20.301

-

-

IDEA Electronic Components Group

UK . 1,074 parts In-Stock

1+ parts

$24.757

100+ parts

$23.519

1k+ parts

$22.281

10k+ parts

-

1,074

$24.757

$23.519

$22.281

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QUARKTWIN TECHNOLOGY LTD

USA . 2,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,410

-

-

-

-

DigiPath Technology Company

USA . 788 parts In-Stock

1+ parts

-

100+ parts

$22.321

1k+ parts

-

10k+ parts

-

788

-

$22.321

-

-

Overview

Enhance your projects with the cutting-edge MSP430F5229IRGCT microcontroller from Texas Instruments. With a reputation for producing high-quality components, Texas Instruments delivers reliable solutions for a multitude of applications in the microcontroller category. This versatile chip offers customers unmatched value with its low power consumption, high performance, and extensive connectivity options. Whether you're a seasoned professional or just starting out, the MSP430F5229IRGCT provides the tools you need to bring your ideas to life and stay ahead of the curve in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the microcontroller suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, offering flexibility in different applications.

Bit Size: 16

The 16-bit architecture allows for more complex operations and calculations, making the microcontroller suitable for applications that require higher processing power.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various industrial and harsh environment conditions.

CPU Family: MSP430

Being part of the MSP430 family, known for its low power consumption and high performance, this microcontroller is a reliable choice for energy-efficient applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels facilitate efficient data transfers without involving the CPU, improving overall performance and responsiveness of the microcontroller.

ROM Programmability: FLASH

The flash ROM programmability feature enables easy and quick updates to the microcontroller's firmware, allowing for flexibility and adaptability in applications.

Technical Specifications

Microcontrollers MSP430F5229IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5229IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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