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MSP430F5229IRGCR

Texas Instruments

MSP430F5229IRGCR by Texas Instruments

MSP430F5229IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8KB of RAM, FLASH ROM programmability, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$4.353

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,027 parts In-Stock

1+ parts

$4.353

100+ parts

$3.549

1k+ parts

$2.366

10k+ parts

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5,027

$4.353

$3.549

$2.366

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 282 parts In-Stock

1+ parts

$4.135

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-

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282

$4.135

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Vyrian

USA . 8,141 parts In-Stock

1+ parts

-

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8,141

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Sensible Micro Corp

USA . 6,157 parts In-Stock

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6,157

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Cyclops Electronics Ltd

UK . 4,894 parts In-Stock

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4,894

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,747 parts In-Stock

1+ parts

$3.700

100+ parts

-

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4,747

$3.700

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Corphita

USA . 1,499 parts In-Stock

1+ parts

$3.918

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1,499

$3.918

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AZTECH Wire

Italy . 933 parts In-Stock

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$12.140

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933

$12.140

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Parana Technologies

USA . 444 parts In-Stock

1+ parts

$38.658

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444

$38.658

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DigiPath Technology Company

USA . 380 parts In-Stock

1+ parts

$42.567

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380

$42.567

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ChromeModa Solutions

Germany . 4,559 parts In-Stock

1+ parts

$43.436

100+ parts

$35.618

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4,559

$43.436

$35.618

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IDEA Electronic Components Group

UK . 183 parts In-Stock

1+ parts

$43.436

100+ parts

$41.264

1k+ parts

$39.092

10k+ parts

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183

$43.436

$41.264

$39.092

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Perfect Parts

USA . 12,629 parts In-Stock

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12,629

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5229IRGCR microcontroller. Known for its unmatched quality and reliability, Texas Instruments sets the standard in the industry. This versatile microcontroller is perfect for a wide range of applications, offering customers value and benefits like low power consumption, high performance, and advanced connectivity options. Whether you're developing smart devices, sensors, or industrial controls, the MSP430F5229IRGCR delivers exceptional performance to bring your ideas to life. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, making the microcontroller versatile and suitable for various applications.

CPU Family: MSP430

Known for its low power consumption and high performance, making it an efficient choice for battery-powered devices.

Maximum Clock Frequency: 32 MHz

Enables fast processing speeds, allowing for quick execution of tasks and operations.

RAM Bytes: 8192

With ample memory space, the microcontroller can store and process a large amount of data efficiently.

Connectivity: "I2C, IRDA, SCI(3), SPI(2), UART

Supports a variety of communication protocols, enabling seamless integration with other devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy and quick reprogramming of the microcontroller, making it flexible for software updates and modifications.

Low Power Mode: YES

The ability to operate in low power modes conserves energy, prolonging battery life and making the microcontroller energy-efficient.

Technical Specifications

Microcontrollers MSP430F5229IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5229IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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