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MSP430F5224IRGZT

Texas Instruments

MSP430F5224IRGZT by Texas Instruments

MSP430F5224IRGZT by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 8192 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$2.760

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.470

10k+ parts

$2.330

84

-

$2.760

$2.470

$2.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,853 parts In-Stock

1+ parts

$2.916

100+ parts

-

1k+ parts

-

10k+ parts

-

1,853

$2.916

-

-

-

Vyrian

USA . 8,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 587 parts In-Stock

1+ parts

$2.763

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$2.763

-

-

-

Component Stockers USA

USA . 116 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$3.160

-

-

-

AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$9.900

100+ parts

-

1k+ parts

-

10k+ parts

-

197

$9.900

-

-

-

Parana Technologies

USA . 656 parts In-Stock

1+ parts

$44.375

100+ parts

-

1k+ parts

-

10k+ parts

-

656

$44.375

-

-

-

DigiPath Technology Company

USA . 2,165 parts In-Stock

1+ parts

$48.863

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

$48.863

-

-

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ChromeModa Solutions

Germany . 3,481 parts In-Stock

1+ parts

$49.860

100+ parts

$40.885

1k+ parts

-

10k+ parts

-

3,481

$49.860

$40.885

-

-

IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$49.860

100+ parts

$47.367

1k+ parts

$44.874

10k+ parts

-

1,289

$49.860

$47.367

$44.874

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Microchip USA

USA . 4,821 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,821

-

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Overview

Unlock the power of innovation with the MSP430F5224IRGZT microcontroller by Texas Instruments. Crafted with precision and expertise, this chip offers unparalleled performance and reliability for a wide range of applications. Whether you're designing cutting-edge electronics or creating IoT devices, this microcontroller provides seamless integration and exceptional functionality. Trust in Texas Instruments to deliver top-of-the-line quality and value, making your projects stand out from the rest. Elevate your designs with the MSP430F5224IRGZT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Provides flexibility in terms of power supply options and compatibility with various systems.

Package Shape: SQUARE

Optimizes space utilization on the PCB, allowing for efficient layout and design.

Bit Size: 16

Provides sufficient processing power for a wide range of applications, balancing performance and cost-effectiveness.

Power Supplies (V): 2/3.3

Provides compatibility with different power supply configurations, increasing flexibility in system design.

No. of Terminals: 48

Offers a sufficient number of connection points for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers various packaging options to suit different application requirements, including heat dissipation and space constraints.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even at lower voltage levels, increasing compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions, making it suitable for industrial applications.

CPU Family: MSP430

Belongs to a reputable and widely used CPU family, offering proven performance and reliability.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme temperatures, ensuring reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections over time.

ADC Channels: YES

Includes analog-to-digital conversion capabilities, essential for interfacing with analog sensors and signals.

DMA Channels: YES

Supports direct memory access, improving data transfer efficiency and freeing up the CPU for other tasks.

Terminal Position: QUAD

Facilitates easy PCB layout and routing, optimizing signal integrity and reducing interference.

ROM Words: 65536

Offers ample storage capacity for program code and data, supporting complex applications.

Maximum Seated Height: 1 mm

Compact size allows for slim and space-efficient PCB designs.

Width: 7 mm

Compact form factor enables integration into small electronic devices and systems.

Maximum Clock Frequency: 32 MHz

High clock frequency supports fast data processing and execution of instructions, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during reflow soldering process, contributing to high manufacturing yield.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, meeting modern environmental and regulatory requirements.

Length: 7 mm

Compact size allows for efficient use of board space and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand extended temperature ranges, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient data processing and control capabilities, ideal for embedded systems.

RAM Bytes: 8192

Provides sufficient memory for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and standards, ensuring safety and sustainability.

Maximum Supply Current: 11 mA

Low supply current consumption contributes to overall energy efficiency and extends battery life in portable devices.

Nominal Supply Voltage: 3 V

Standard supply voltage ensures compatibility with common power sources, simplifying system design.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, essential for motor control and power management.

ROM Programmability: FLASH

Flash ROM allows for easy and efficient programming and updating of firmware, enabling flexibility and future-proofing.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB layouts, optimizing space utilization and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 25 rpm

Operates at a moderate speed suitable for a wide range of applications, balancing performance and power consumption.

No. of I/O Lines: 37

Sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing versatility and connectivity.

Technical Specifications

Microcontrollers MSP430F5224IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F5224IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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