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MSP430F5222IRGZT

Texas Instruments

MSP430F5222IRGZT by Texas Instruments

MSP430F5222IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 3.6V max supply voltage, and 8KB RAM. Ideal for industrial applications, it features I2C, IRDA, SCI(3), SPI(2), UART connectivity options and low power mode for efficient operation in various systems. With 37 I/O lines and flash ROM programmability, this chip carrier microcontroller offers versatile performance in compact designs.

Median Price

$4.945

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$4.945

100+ parts

$4.333

1k+ parts

$2.448

10k+ parts

-

450

$4.945

$4.333

$2.448

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,538 parts In-Stock

1+ parts

$4.698

100+ parts

-

1k+ parts

-

10k+ parts

-

2,538

$4.698

-

-

-

Vyrian

USA . 4,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,192 parts In-Stock

1+ parts

$4.450

100+ parts

-

1k+ parts

-

10k+ parts

-

4,192

$4.450

-

-

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AZTECH Wire

Italy . 38 parts In-Stock

1+ parts

$8.430

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$8.430

-

-

-

Parana Technologies

USA . 2,134 parts In-Stock

1+ parts

$23.338

100+ parts

-

1k+ parts

$23.978

10k+ parts

-

2,134

$23.338

-

$23.978

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DigiPath Technology Company

USA . 1,719 parts In-Stock

1+ parts

$25.698

100+ parts

$23.642

1k+ parts

-

10k+ parts

-

1,719

$25.698

$23.642

-

-

ChromeModa Solutions

Germany . 2,072 parts In-Stock

1+ parts

$26.222

100+ parts

$21.502

1k+ parts

-

10k+ parts

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2,072

$26.222

$21.502

-

-

IDEA Electronic Components Group

UK . 1,152 parts In-Stock

1+ parts

$26.222

100+ parts

$24.911

1k+ parts

$23.600

10k+ parts

-

1,152

$26.222

$24.911

$23.600

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Microchip USA

USA . 2,595 parts In-Stock

1+ parts

$29.730

100+ parts

$29.550

1k+ parts

$29.460

10k+ parts

$29.370

2,595

$29.730

$29.550

$29.460

$29.370

QUARKTWIN TECHNOLOGY LTD

USA . 21,366 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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21,366

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-

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iodParts Technologies Inc.

India . 3,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,600

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Overview

Discover the Texas Instruments MSP430F5222IRGZT, a high-quality microcontroller that offers unparalleled performance and reliability. With a wide range of applications in various industries, this powerful device from a reputable manufacturer provides customers with exceptional value and benefits. Whether you're looking to streamline your automation processes or enhance your IoT projects, the MSP430F5222IRGZT delivers cutting-edge technology and efficiency. Experience the advantages of this innovative product and take your projects to the next level today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, making it versatile for various applications.

Bit Size: 16

Having a 16-bit architecture allows for higher computational capabilities and precision in processing data, making it suitable for complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient and fast processing of instructions, making it ideal for high-performance applications.

Maximum Clock Frequency: 32 MHz

A high clock frequency allows for quick execution of instructions, enabling fast operation and response times in the microcontroller.

ROM Programmability: FLASH

The use of Flash memory for ROM allows for easy and quick reprogramming of the microcontroller, making it flexible for changes and updates in the firmware.

No. of Timers: 18

Having 18 timers provides versatility in scheduling and timing functions, allowing for precise control and synchronization in applications that require timed operations.

Technical Specifications

Microcontrollers MSP430F5222IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

37

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5222IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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