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MSP430F5219IZQER

Texas Instruments

MSP430F5219IZQER by Texas Instruments

MSP430F5219IZQER by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 32 MHz. Ideal for industrial applications, it features 65536 ROM words, 8192 RAM bytes, and ADC/DMA channels for efficient data processing. With a wide temperature range (-40 to 85 °C) and low power consumption (11 mA), it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,810 parts In-Stock

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3,810

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Digiode

USA . 2,792 parts In-Stock

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2,792

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Distributors (Availability)

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One Stop Electronics

USA . 1,627 parts In-Stock

1+ parts

$2.000

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1,627

$2.000

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AZTECH Wire

Italy . 213 parts In-Stock

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$14.226

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213

$14.226

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Parana Technologies

USA . 1,951 parts In-Stock

1+ parts

$76.439

100+ parts

$7,098.561

1k+ parts

$68.795

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1,951

$76.439

$7,098.561

$68.795

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DigiPath Technology Company

USA . 168 parts In-Stock

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$84.169

100+ parts

$77.436

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168

$84.169

$77.436

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ChromeModa Solutions

Germany . 3,760 parts In-Stock

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$85.887

100+ parts

$70.427

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3,760

$85.887

$70.427

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$85.887

100+ parts

$81.593

1k+ parts

$77.298

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893

$85.887

$81.593

$77.298

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Corphita

USA . 2,090 parts In-Stock

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Microchip USA

USA . 396 parts In-Stock

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396

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Overview

Unlock the power of innovation with the MSP430F5219IZQER from Texas Instruments, a leading manufacturer in the industry. This microcontroller offers endless possibilities for applications in various fields, providing exceptional quality and reliability. Experience seamless performance with its 16-bit architecture, advanced ADC and DMA channels, and robust ROM programmability. With a wide range of features packed into a compact package, this product delivers unparalleled value and benefits to customers seeking cutting-edge solutions for their projects. Embrace the future of technology with the MSP430F5219IZQER and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply choices.

Package Shape: SQUARE

The square package shape is space-efficient and easy to handle during assembly.

Bit Size: 16

With a 16-bit size, this microcontroller can handle data processing and calculations efficiently.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enables flexibility in system design.

No. of Terminals: 80

The high number of terminals allows for connectivity with a variety of external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers space-saving benefits and efficient signal routing on the PCB.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can be used in harsh environmental conditions.

Technical Specifications

Microcontrollers MSP430F5219IZQER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F5219IZQER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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