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MSP430F5218IRGCR

Texas Instruments

MSP430F5218IRGCR by Texas Instruments

MSP430F5218IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 8192 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring low power consumption and high performance in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,846 parts In-Stock

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Vyrian

USA . 3,420 parts In-Stock

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3,420

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Distributors (Availability)

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One Stop Electronics

USA . 870 parts In-Stock

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$7.000

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870

$7.000

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AZTECH Wire

Italy . 640 parts In-Stock

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$11.689

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640

$11.689

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Parana Technologies

USA . 2,229 parts In-Stock

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$35.734

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$35.734

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DigiPath Technology Company

USA . 1,722 parts In-Stock

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$39.347

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$36.199

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1,722

$39.347

$36.199

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ChromeModa Solutions

Germany . 3,335 parts In-Stock

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$40.150

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$32.923

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$40.150

$32.923

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IDEA Electronic Components Group

UK . 2,326 parts In-Stock

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$40.150

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$38.142

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$36.135

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2,326

$40.150

$38.142

$36.135

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Component Stockers USA

USA . 697 parts In-Stock

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$99.990

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Corphita

USA . 3,476 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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Overview

Elevate your projects with the Texas Instruments MSP430F5218IRGCR microcontroller, a powerful and versatile solution for a wide range of applications. With a reputation for high-quality manufacturing, Texas Instruments delivers reliability and performance in every product. This microcontroller boasts impressive features like ADC and DMA channels, Flash ROM programmability, and PWM channels, offering customers unparalleled value and benefits. Whether you're working on industrial automation, consumer electronics, or IoT devices, the MSP430F5218IRGCR is the key to unlocking endless possibilities. Trust in Texas Instruments for cutting-edge technology that propels your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, offering flexibility in power source options.

Bit Size: 16

Offers a good balance between processing power and complexity, suitable for a wide range of tasks.

Power Supplies (V): 2/3.3

Supports multiple power supply options, making it versatile for different voltage requirements.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for efficient heat dissipation and compact design, suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, increasing its range of usability.

CPU Family: MSP430

Based on a proven CPU architecture known for its low power consumption and high efficiency.

RAM Bytes: 8192

Offers a decent amount of memory for storing data and executing tasks, suitable for various applications.

Technical Specifications

Microcontrollers MSP430F5218IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MSP430F5218IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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