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MSP430F5217IRGCT

Texas Instruments

MSP430F5217IRGCT by Texas Instruments

MSP430F5217IRGCT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 3.6V max supply voltage, and 64 terminals. Ideal for industrial applications, it features 8KB RAM, FLASH ROM programmability, and connectivity options like I2C and UART for efficient data processing in compact designs.

Median Price

$4.111

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,000 parts In-Stock

1+ parts

$4.111

100+ parts

$3.602

1k+ parts

$2.035

10k+ parts

-

1,000

$4.111

$3.602

$2.035

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$6.660

100+ parts

$4.010

1k+ parts

$3.160

10k+ parts

-

2

$6.660

$4.010

$3.160

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.522

10k+ parts

-

250

-

-

$3.522

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,398 parts In-Stock

1+ parts

$3.905

100+ parts

-

1k+ parts

-

10k+ parts

-

4,398

$3.905

-

-

-

Vyrian

USA . 2,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,930 parts In-Stock

1+ parts

$3.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,930

$3.700

-

-

-

Microchip USA

USA . 1,922 parts In-Stock

1+ parts

$29.080

100+ parts

$28.900

1k+ parts

$28.810

10k+ parts

$28.720

1,922

$29.080

$28.900

$28.810

$28.720

Parana Technologies

USA . 89 parts In-Stock

1+ parts

$40.215

100+ parts

$3,734.540

1k+ parts

$36.193

10k+ parts

-

89

$40.215

$3,734.540

$36.193

-

DigiPath Technology Company

USA . 2,210 parts In-Stock

1+ parts

$44.281

100+ parts

$40.739

1k+ parts

-

10k+ parts

-

2,210

$44.281

$40.739

-

-

ChromeModa Solutions

Germany . 3,548 parts In-Stock

1+ parts

$45.185

100+ parts

$37.052

1k+ parts

-

10k+ parts

-

3,548

$45.185

$37.052

-

-

IDEA Electronic Components Group

UK . 1,781 parts In-Stock

1+ parts

$45.185

100+ parts

$42.926

1k+ parts

$40.666

10k+ parts

-

1,781

$45.185

$42.926

$40.666

-

Overview

Enhance your electronics projects with the Texas Instruments MSP430F5217IRGCT Microcontroller, renowned for its superior quality and reliability. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering unmatched value, efficiency, and performance. With features like low power mode and multiple connectivity options, the MSP430F5217IRGCT empowers you to innovate and create with ease. Upgrade your projects today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides lightweight and durable packaging for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Ability to handle up to 3.6V supply voltage ensures compatibility with a wide range of power sources.

CPU Family: MSP430

Being part of the MSP430 family ensures reliable performance and compatibility with other MSP430 devices.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds, ideal for applications requiring real-time data processing.

No. of Timers: 18

Multiple timers provide versatile timing functions for precise control and synchronization in different applications.

Connectivity: "I2C, IRDA, SCI(3), SPI(2), UART

Support for various communication interfaces enables seamless connectivity with other devices and peripherals.

Technical Specifications

Microcontrollers MSP430F5217IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

53

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5217IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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