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MSP430F5214IRGZR

Texas Instruments

MSP430F5214IRGZR by Texas Instruments

MSP430F5214IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 32 MHz. It features 8KB RAM, FLASH ROM programmability, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$4.298

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,749 parts In-Stock

1+ parts

$4.298

100+ parts

$3.504

1k+ parts

$2.336

10k+ parts

-

5,749

$4.298

$3.504

$2.336

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,501 parts In-Stock

1+ parts

$4.083

100+ parts

-

1k+ parts

-

10k+ parts

-

2,501

$4.083

-

-

-

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$17.116

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$17.116

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-

-

Vyrian

USA . 3,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,744

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,743 parts In-Stock

1+ parts

$3.868

100+ parts

-

1k+ parts

-

10k+ parts

-

3,743

$3.868

-

-

-

AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$20.740

100+ parts

-

1k+ parts

-

10k+ parts

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481

$20.740

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-

-

Parana Technologies

USA . 1,169 parts In-Stock

1+ parts

$54.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$54.480

-

-

-

DigiPath Technology Company

USA . 223 parts In-Stock

1+ parts

$59.990

100+ parts

-

1k+ parts

-

10k+ parts

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223

$59.990

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-

-

ChromeModa Solutions

Germany . 4,340 parts In-Stock

1+ parts

$61.214

100+ parts

$50.195

1k+ parts

-

10k+ parts

-

4,340

$61.214

$50.195

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-

IDEA Electronic Components Group

UK . 319 parts In-Stock

1+ parts

$61.214

100+ parts

$58.153

1k+ parts

$55.093

10k+ parts

-

319

$61.214

$58.153

$55.093

-

Overview

Elevate your projects with the Texas Instruments MSP430F5214IRGZR microcontroller. Designed with precision and reliability by a trusted manufacturer, this device offers endless possibilities in various applications. From IoT devices to industrial automation, the MSP430F5214IRGZR provides unparalleled performance and efficiency. Experience seamless connectivity, low power consumption, and advanced peripheral features that set this microcontroller apart from the rest. Unlock the full potential of your designs with the MSP430F5214IRGZR and embrace innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount feature allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Can operate at relatively higher supply voltage, providing flexibility in power supply options.

On Chip Data RAM Width: 8

8-bit wide RAM provides sufficient memory for data storage and processing.

Package Shape: SQUARE

Square package shape facilitates easier placement on the PCB and efficient use of space.

Bit Size: 16

16-bit architecture enables fast and efficient data processing.

Power Supplies (V): 2/3.3

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 48

Sufficient number of terminals for interfacing with external components and peripherals.

Minimum Supply Voltage: 2.4 V

Can operate at lower supply voltage for power efficiency.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Part of a well-established CPU family known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections and corrosion resistance.

ADC Channels: YES

Built-in ADC channels for analog signal processing and conversion.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing.

ROM Words: 65536

Large ROM capacity for storing program instructions and data.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast data processing and efficient operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and faster execution of instructions.

No. of Timers: 18

Multiple timers for precise timing and control in various applications.

RAM Bytes: 8192

Sufficient RAM capacity for data storage and program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

ADC Channels: YES

Built-in ADC channels for analog signal processing and conversion.

No. of Serial I/Os: 2

Multiple serial I/O interfaces for communication with external devices.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals.

Connectivity: I2C, IRDA, SCI(3), SPI(2), UART

Supports multiple communication protocols for interfacing with various peripherals and devices.

ROM Programmability: FLASH

Flash ROM allows for easy and efficient programming of the device.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures that the device is moisture resistant, suitable for a variety of environments.

Low Power Mode: YES

Includes low power mode for energy-efficient operation and extended battery life.

Technical Specifications

Microcontrollers MSP430F5214IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

37

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5214IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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