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MSP430F5212IRGZT

Texas Instruments

MSP430F5212IRGZT by Texas Instruments

MSP430F5212IRGZT by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 3.6V max supply voltage, and 37 I/O lines. Ideal for industrial applications requiring low power consumption, it features ADC and PWM channels, along with connectivity options like I2C and SPI.

Median Price

$3.844

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$3.844

100+ parts

$3.134

1k+ parts

$2.089

10k+ parts

-

450

$3.844

$3.134

$2.089

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,127 parts In-Stock

1+ parts

$3.652

100+ parts

-

1k+ parts

-

10k+ parts

-

3,127

$3.652

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.129

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.129

-

-

-

Vyrian

USA . 6,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,689

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,323 parts In-Stock

1+ parts

$3.460

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

$3.460

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-

-

AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$13.050

100+ parts

-

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-

10k+ parts

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335

$13.050

-

-

-

Microchip USA

USA . 2,724 parts In-Stock

1+ parts

$25.370

100+ parts

$25.220

1k+ parts

$25.140

10k+ parts

$25.060

2,724

$25.370

$25.220

$25.140

$25.060

Parana Technologies

USA . 480 parts In-Stock

1+ parts

$36.216

100+ parts

-

1k+ parts

-

10k+ parts

-

480

$36.216

-

-

-

DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

$39.878

100+ parts

$36.688

1k+ parts

-

10k+ parts

-

2,062

$39.878

$36.688

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-

ChromeModa Solutions

Germany . 5,121 parts In-Stock

1+ parts

$40.692

100+ parts

$33.367

1k+ parts

-

10k+ parts

-

5,121

$40.692

$33.367

-

-

IDEA Electronic Components Group

UK . 1,845 parts In-Stock

1+ parts

$40.692

100+ parts

$38.657

1k+ parts

$36.623

10k+ parts

-

1,845

$40.692

$38.657

$36.623

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iodParts Technologies Inc.

India . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,600

-

-

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Component Stockers USA

USA . 339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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339

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Overview

Unleash the power of innovation with the MSP430F5212IRGZT by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology. As a standout in the Microcontrollers category, this product offers unmatched quality and reliability. With a focus on value and performance, customers can expect seamless integration into a variety of applications. Experience the benefits of advanced features like ADC channels, DMA channels, and low power mode, all in a compact package that delivers exceptional results. Elevate your projects to new heights with the MSP430F5212IRGZT - where excellence meets efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options.

No. of Terminals: 48

Large number of terminals provide extensive connectivity options.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast data processing and execution.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design enhance processing efficiency and speed.

Connectivity: I2C, IRDA, SCI(3), SPI(2), UART

Multiple connectivity options allow for seamless communication with various devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware.

Low Power Mode: YES

Low power mode feature helps in conserving energy and extending battery life.

Technical Specifications

Microcontrollers MSP430F5212IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V AT 8MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

37

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

"I2C, IRDA, SCI(3), SPI(2), UART"

Trade Compliance

MSP430F5212IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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