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MSP430F5172IYFFT

Texas Instruments

MSP430F5172IYFFT by Texas Instruments

MSP430F5172IYFFT by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at a max frequency of 32 MHz. It features 9 ADC channels and 3 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via I2C, SPI, and UART interfaces.

Median Price

$4.377

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,240 parts In-Stock

1+ parts

$3.664

100+ parts

$3.211

1k+ parts

$1.814

10k+ parts

-

13,240

$3.664

$3.211

$1.814

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DigiKey

USA . 221 parts In-Stock

1+ parts

$5.090

100+ parts

$3.244

1k+ parts

$3.085

10k+ parts

-

221

$5.090

$3.244

$3.085

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,493 parts In-Stock

1+ parts

$3.481

100+ parts

-

1k+ parts

-

10k+ parts

-

3,493

$3.481

-

-

-

Classic Components Corporation

USA . 12,877 parts In-Stock

1+ parts

-

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-

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12,877

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-

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Vyrian

USA . 3,488 parts In-Stock

1+ parts

-

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3,488

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,296 parts In-Stock

1+ parts

$3.298

100+ parts

-

1k+ parts

-

10k+ parts

-

4,296

$3.298

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.929

100+ parts

$18.135

1k+ parts

$16.342

10k+ parts

-

500

$19.929

$18.135

$16.342

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Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$25.790

100+ parts

-

1k+ parts

$26.393

10k+ parts

-

2,352

$25.790

-

$26.393

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ChromeModa Solutions

Germany . 2,684 parts In-Stock

1+ parts

$28.977

100+ parts

$23.761

1k+ parts

-

10k+ parts

-

2,684

$28.977

$23.761

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IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$28.977

100+ parts

$27.528

1k+ parts

$26.079

10k+ parts

-

241

$28.977

$27.528

$26.079

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

-

100+ parts

$26.126

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-

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1,334

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$26.126

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Microchip USA

USA . 951 parts In-Stock

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951

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Perfect Parts

USA . 129 parts In-Stock

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129

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F5172IYFFT microcontroller. Crafted with precision and expertise, this device offers unparalleled quality and reliability in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features such as ADC channels, DMA capabilities, and low power modes. Experience seamless connectivity with I2C, SPI, and UART interfaces, while enjoying the benefits of its high-speed performance and flash ROM programmability. Elevate your designs with the MSP430F5172IYFFT and discover the limitless possibilities it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures the product is robust and reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, providing flexibility in power sources and compatibility with a wide range of applications.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperature environments, making it suitable for a variety of industrial and outdoor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses Reduced Instruction Set Computing (RISC) architecture for efficient processing and optimized performance in embedded systems.

RAM Bytes: 2048

Sufficient random access memory for storing and processing data, enhancing the overall performance of the microcontroller.

Analog To Digital Convertors: 9-Ch 10-Bit

Features multiple analog-to-digital converters with high resolution, allowing for accurate conversion of analog signals to digital data.

Connectivity: I2C, SPI(2), UART

Supports various communication interfaces for seamless integration with other devices and systems, enabling versatile connectivity options.

Low Power Mode: YES

Includes low power consumption mode for energy efficiency, extending battery life and reducing overall power consumption.

Technical Specifications

Microcontrollers MSP430F5172IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

MSP430F5172IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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