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MSP430F5171IRSBT

Texas Instruments

MSP430F5171IRSBT by Texas Instruments

MSP430F5171IRSBT by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at up to 25 MHz. It features ADC and DMA channels, along with BOR, CRC, PWM, and UART connectivity. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact chip carrier package.

Median Price

$4.567

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 118 parts In-Stock

1+ parts

$1.640

100+ parts

$1.610

1k+ parts

$1.570

10k+ parts

-

118

$1.640

$1.610

$1.570

-

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$3.664

100+ parts

$3.211

1k+ parts

$1.814

10k+ parts

-

1,500

$3.664

$3.211

$1.814

-

DigiKey

USA . 245 parts In-Stock

1+ parts

$5.470

100+ parts

$3.502

1k+ parts

$3.333

10k+ parts

-

245

$5.470

$3.502

$3.333

-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$5.470

100+ parts

$3.510

1k+ parts

$3.220

10k+ parts

-

30

$5.470

$3.510

$3.220

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,356 parts In-Stock

1+ parts

$3.481

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

$3.481

-

-

-

Vyrian

USA . 2,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,403

-

-

-

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Speed Components Ltd

Israel . 1,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,806

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,274 parts In-Stock

1+ parts

$3.298

100+ parts

-

1k+ parts

-

10k+ parts

-

2,274

$3.298

-

-

-

Parana Technologies

USA . 955 parts In-Stock

1+ parts

$27.960

100+ parts

-

1k+ parts

$42.182

10k+ parts

-

955

$27.960

-

$42.182

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

$30.788

100+ parts

$28.325

1k+ parts

-

10k+ parts

-

1,647

$30.788

$28.325

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ChromeModa Solutions

Germany . 3,939 parts In-Stock

1+ parts

$31.416

100+ parts

$25.761

1k+ parts

-

10k+ parts

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3,939

$31.416

$25.761

-

-

IDEA Electronic Components Group

UK . 618 parts In-Stock

1+ parts

$31.416

100+ parts

$29.845

1k+ parts

$28.274

10k+ parts

-

618

$31.416

$29.845

$28.274

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Perfect Parts

USA . 1,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,478

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Overview

Experience the next level of innovation with Texas Instruments' MSP430F5171IRSBT microcontroller. Designed for high-performance applications, this versatile chip offers a wide range of peripherals including BOR, CRC, and PWM, making it ideal for a variety of industrial uses. With a maximum clock frequency of 25 MHz and low power mode capabilities, this microcontroller provides efficient and reliable performance. Trust in Texas Instruments' reputation for quality and precision engineering, and unlock endless possibilities with the MSP430F5171IRSBT. Elevate your projects today with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on a circuit board, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options for flexibility in system design.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention, improving overall system performance.

ROM Words: 32768

Provides ample storage for program instructions and data, allowing for complex applications to be run on the microcontroller.

Maximum Clock Frequency: 25 MHz

Offers high-speed operation, enabling quick processing of data and rapid response to external events.

RAM Bytes: 2048

Allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's processing capabilities.

Connectivity: I2C, SPI(2), UART

Supports multiple communication interfaces, facilitating interaction with external devices and peripherals.

Low Power Mode: YES

Enables energy-efficient operation, prolonging battery life and reducing power consumption in portable or battery-powered applications.

Technical Specifications

Microcontrollers MSP430F5171IRSBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5171IRSBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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