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MSP430F5151IRSBT

Texas Instruments

MSP430F5151IRSBT by Texas Instruments

MSP430F5151IRSBT by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 2048 RAM bytes, and 31 I/O lines. It operates at up to 25 MHz, features BOR, CRC, PWM, UART connectivity, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$4.082

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,550 parts In-Stock

1+ parts

$3.404

100+ parts

$2.982

1k+ parts

$1.685

10k+ parts

-

16,550

$3.404

$2.982

$1.685

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DigiKey

USA . 457 parts In-Stock

1+ parts

$4.760

100+ parts

$3.022

1k+ parts

$2.873

10k+ parts

-

457

$4.760

$3.022

$2.873

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 436 parts In-Stock

1+ parts

$3.234

100+ parts

-

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-

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436

$3.234

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-

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Vyrian

USA . 6,218 parts In-Stock

1+ parts

-

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6,218

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Quantum Digital Technology

USA . 500 parts In-Stock

1+ parts

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,209 parts In-Stock

1+ parts

$3.064

100+ parts

-

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-

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4,209

$3.064

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-

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Parana Technologies

USA . 139 parts In-Stock

1+ parts

$33.976

100+ parts

-

1k+ parts

$138.544

10k+ parts

-

139

$33.976

-

$138.544

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DigiPath Technology Company

USA . 2,306 parts In-Stock

1+ parts

$37.412

100+ parts

$34.419

1k+ parts

-

10k+ parts

-

2,306

$37.412

$34.419

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ChromeModa Solutions

Germany . 2,294 parts In-Stock

1+ parts

$38.175

100+ parts

$31.304

1k+ parts

-

10k+ parts

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2,294

$38.175

$31.304

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IDEA Electronic Components Group

UK . 543 parts In-Stock

1+ parts

$38.175

100+ parts

$36.266

1k+ parts

$34.358

10k+ parts

-

543

$38.175

$36.266

$34.358

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QUARKTWIN TECHNOLOGY LTD

USA . 20,278 parts In-Stock

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20,278

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Kepictronics

USA . 250 parts In-Stock

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250

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430F5151IRSBT microcontroller, designed to elevate your projects to new heights. This high-quality product boasts cutting-edge technology from a trusted manufacturer, offering unrivaled performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value, seamless connectivity, and low power consumption. Experience the advantages of the MSP430 family and unleash your creativity with this versatile and innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring it remains robust and long-lasting.

Max Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages, providing flexibility in power supply design.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

ROM Words: 16384

With a large amount of ROM words, the microcontroller can store more program code and data, making it suitable for complex applications that require extensive memory.

Maximum Clock Frequency: 25 MHz

A high clock frequency allows the microcontroller to execute instructions quickly, improving its overall performance in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance with reduced instruction set complexity, making it efficient for handling tasks quickly and effectively.

RAM Bytes: 2048

Having a decent amount of RAM allows the microcontroller to store and access data quickly, enhancing its capability to support multitasking and data-intensive operations.

Connectivity: I2C, SPI(2), UART

The microcontroller's multiple connectivity options enable seamless communication with a variety of external devices, making it versatile and suitable for diverse applications.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during periods of inactivity, prolonging battery life and making it ideal for power-sensitive applications.

Technical Specifications

Microcontrollers MSP430F5151IRSBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5151IRSBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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