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MSP430F5132IRSBT

Texas Instruments

MSP430F5132IRSBT by Texas Instruments

MSP430F5132IRSBT by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at up to 25 MHz. It features 9 ADC channels, 3 DMA channels, and peripherals like BOR, CRC, and PWM. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.018

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150 parts In-Stock

1+ parts

$1.360

100+ parts

$1.330

1k+ parts

$1.310

10k+ parts

-

150

$1.360

$1.330

$1.310

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Texas Instruments

USA . 19,000 parts In-Stock

1+ parts

$2.444

100+ parts

$2.142

1k+ parts

$1.210

10k+ parts

-

19,000

$2.444

$2.142

$1.210

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DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.018

10k+ parts

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500

-

-

$2.018

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,763 parts In-Stock

1+ parts

$1.596

100+ parts

-

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2,763

$1.596

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-

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$1.620

100+ parts

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79

$1.620

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Vyrian

USA . 7,394 parts In-Stock

1+ parts

-

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7,394

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ACDS - Activité Composants Distribution Service

France . 222 parts In-Stock

1+ parts

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222

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Bristol Electronics

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.133

10k+ parts

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222

-

$1.220

$1.133

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Dan-Mar Components

USA . 222 parts In-Stock

1+ parts

-

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222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,543 parts In-Stock

1+ parts

$1.430

100+ parts

-

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10k+ parts

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6,543

$1.430

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Corphita

USA . 955 parts In-Stock

1+ parts

$1.512

100+ parts

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955

$1.512

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.620

100+ parts

$1.588

1k+ parts

-

10k+ parts

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100

$1.620

$1.588

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-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$18.692

100+ parts

$17.010

1k+ parts

$15.327

10k+ parts

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2,000

$18.692

$17.010

$15.327

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Parana Technologies

USA . 1,459 parts In-Stock

1+ parts

$75.902

100+ parts

-

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10k+ parts

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1,459

$75.902

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ChromeModa Solutions

Germany . 3,492 parts In-Stock

1+ parts

$85.283

100+ parts

$69.932

1k+ parts

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3,492

$85.283

$69.932

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IDEA Electronic Components Group

UK . 1,845 parts In-Stock

1+ parts

$85.283

100+ parts

$81.019

1k+ parts

$76.755

10k+ parts

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1,845

$85.283

$81.019

$76.755

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DigiPath Technology Company

USA . 2,075 parts In-Stock

1+ parts

-

100+ parts

$76.891

1k+ parts

-

10k+ parts

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2,075

-

$76.891

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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100+ parts

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1,500

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Overview

Unlock endless possibilities with the MSP430F5132IRSBT by Texas Instruments, a top-of-the-line microcontroller designed to deliver unmatched performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial applications, this powerful chip offers exceptional value with its low power consumption, high-speed operation, and versatile connectivity options. Trust in Texas Instruments' proven track record of excellence and innovation, and take your projects to the next level with the MSP430F5132IRSBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the microcontroller lightweight and durable, suitable for portable and rugged applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can function reliably in harsh environmental conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to efficiently convert analog signals into digital values, enabling accurate sensor data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it offers high performance with reduced instruction set computing, making it ideal for real-time control applications.

Technology: CMOS

CMOS technology used in this microcontroller provides low power consumption and high noise immunity, making it energy-efficient and reliable.

Analog To Digital Convertors: 9-Ch 10-Bit

With 9 channels of 10-bit ADC, the microcontroller can handle multiple analog inputs simultaneously with high precision, suitable for diverse sensor interfacing.

Technical Specifications

Microcontrollers MSP430F5132IRSBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

MSP430F5132IRSBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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