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MSP430F5131IYFFR

Texas Instruments

MSP430F5131IYFFR by Texas Instruments

MSP430F5131IYFFR by Texas Instruments is a 16-bit microcontroller with 8192 ROM words, 1024 RAM bytes, and 31 I/O lines. It operates at a max clock frequency of 32 MHz and features peripherals like BOR, CRC, and PWM. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, and UART interfaces.

Median Price

$2.036

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,527 parts In-Stock

1+ parts

$2.036

100+ parts

$1.784

1k+ parts

$1.008

10k+ parts

-

5,527

$2.036

$1.784

$1.008

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 956 parts In-Stock

1+ parts

$1.934

100+ parts

-

1k+ parts

-

10k+ parts

-

956

$1.934

-

-

-

Vyrian

USA . 2,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,309 parts In-Stock

1+ parts

$1.832

100+ parts

-

1k+ parts

-

10k+ parts

-

3,309

$1.832

-

-

-

Microchip USA

USA . 5,489 parts In-Stock

1+ parts

$9.173

100+ parts

-

1k+ parts

-

10k+ parts

-

5,489

$9.173

-

-

-

AZTECH Wire

Italy . 1,108 parts In-Stock

1+ parts

$9.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,108

$9.750

-

-

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Parana Technologies

USA . 171 parts In-Stock

1+ parts

$72.846

100+ parts

-

1k+ parts

-

10k+ parts

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171

$72.846

-

-

-

ChromeModa Solutions

Germany . 1,670 parts In-Stock

1+ parts

$81.850

100+ parts

$67.117

1k+ parts

-

10k+ parts

-

1,670

$81.850

$67.117

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$81.850

100+ parts

$77.758

1k+ parts

$73.665

10k+ parts

-

1,036

$81.850

$77.758

$73.665

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DigiPath Technology Company

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

$73.796

1k+ parts

-

10k+ parts

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1,121

-

$73.796

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Overview

Unleash the power of innovation with the MSP430F5131IYFFR microcontroller from Texas Instruments. Built with precision and expertise, this device offers unmatched performance in a compact package. Ideal for a variety of applications, this microcontroller provides seamless connectivity and low power consumption, making it a valuable asset for your projects. Elevate your designs with the reliability and efficiency of the MSP430F5131IYFFR, where quality meets functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements for different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing the overall design layout.

Bit Size: 16

16-bit processing capability enables the microcontroller to perform complex tasks and calculations efficiently.

No. of Terminals: 40

A higher number of terminals allow for more connectivity options and peripherals to be interfaced with the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design enhances the overall reliability and performance of the microcontroller.

Minimum Supply Voltage: 2.4 V

Supports lower supply voltages, enabling the microcontroller to operate efficiently in low-power applications.

Maximum Operating Temperature: 85 °C

Operates effectively at high temperatures, making it suitable for industrial applications where temperature variations are common.

CPU Family: MSP430

Part of the MSP430 CPU family known for its low power consumption and high performance, making it an excellent choice for battery-powered applications.

Minimum Operating Temperature: -40 °C

Able to withstand extremely low temperatures, ensuring reliable operation in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, increasing the longevity of the microcontroller.

ADC Channels: YES

Built-in analog-to-digital converter channels allow for precise and accurate analog signal processing, expanding the range of applications the microcontroller can support.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position ensures easy PCB mounting and soldering, simplifying the assembly process.

ROM Words: 8192

8192 ROM words provide ample storage for program instructions and data, enabling the microcontroller to support complex algorithms and applications.

Maximum Seated Height: 0.625 mm

Low seated height allows for a compact design, saving space on the PCB and enabling integration into small form factor devices.

Width: 2.76 mm

Narrow width makes the microcontroller suitable for compact designs where space is limited.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging, ensuring the reliability and quality of the final product.

Peripherals: BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Comprehensive set of peripherals provides enhanced functionality and versatility, making the microcontroller suitable for a wide range of applications.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast data processing and execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for extended periods, ensuring the reliability of the solder joints during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering and assembly, especially in lead-free processes.

Length: 3.06 mm

Compact length allows for space-saving PCB designs, making it suitable for small and portable electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design offer high performance and efficiency, making it ideal for applications requiring real-time operation and low power consumption.

RAM Bytes: 1024

1024 bytes of RAM provide temporary data storage for efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the microcontroller suitable for battery-powered and portable devices.

Terminal Form: BALL

Ball terminal form simplifies the soldering process and ensures reliable electrical connections, improving overall product quality.

Maximum Supply Current: 6.15 mA

Low supply current consumption minimizes power usage, making the microcontroller energy-efficient and suitable for battery-powered applications.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and reliable operation in a wide range of applications.

No. of DMA Channels: 3

Three DMA channels provide efficient data transfer and processing capabilities, improving system performance and scalability.

PWM Channels: YES

Built-in PWM channels enable precise control of analog signals and motor speed, making the microcontroller suitable for applications requiring accurate modulation.

Connectivity: I2C, SPI(2), UART

Support for I2C, SPI, and UART communication interfaces allows for seamless connectivity with external devices and peripherals, expanding the range of applications the microcontroller can support.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible firmware updates, ensuring the microcontroller can adapt to changing requirements and functionalities.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density PCB designs, maximizing connectivity options and overall system integration.

Speed: 25 rpm

Operates at a speed of 25 rpm, suitable for various motor control and speed regulation applications.

Low Power Mode: YES

Supports low power mode functionality, optimizing energy efficiency and extending battery life in battery-powered applications.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides efficient storage and execution of program instructions, enhancing the microcontroller's performance capabilities.

No. of I/O Lines: 31

31 I/O lines allow for versatile connectivity options and interfacing with external devices and peripherals, expanding the functionality and applications of the microcontroller.

Technical Specifications

Microcontrollers MSP430F5131IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

3.06 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA40,6X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.76 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5131IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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