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MSP430F5131IRSBT

Texas Instruments

MSP430F5131IRSBT by Texas Instruments

MSP430F5131IRSBT by Texas Instruments is a 16-bit microcontroller with 8192 ROM words, 1024 RAM bytes, and 31 I/O lines. It operates at up to 25 MHz, has DMA and PWM channels, and supports I2C, SPI, and UART connectivity. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$2.290

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,097 parts In-Stock

1+ parts

$2.444

100+ parts

$2.142

1k+ parts

$1.210

10k+ parts

-

3,097

$2.444

$2.142

$1.210

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$4.240

100+ parts

$2.650

1k+ parts

$1.900

10k+ parts

$1.870

225

$4.240

$2.650

$1.900

$1.870

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.560

10k+ parts

$1.460

500

-

$1.740

$1.560

$1.460

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.290

10k+ parts

-

500

-

-

$2.290

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.825

500

-

-

$1.950

$1.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,639 parts In-Stock

1+ parts

$1.596

100+ parts

-

1k+ parts

-

10k+ parts

-

2,639

$1.596

-

-

-

Vyrian

USA . 3,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,424

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 744 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

744

$1.430

-

-

-

Corphita

USA . 2,444 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

-

2,444

$1.512

-

-

-

Microchip USA

USA . 2,905 parts In-Stock

1+ parts

$14.700

100+ parts

$14.610

1k+ parts

$14.560

10k+ parts

$14.510

2,905

$14.700

$14.610

$14.560

$14.510

Parana Technologies

USA . 2,111 parts In-Stock

1+ parts

$43.786

100+ parts

$4,066.215

1k+ parts

$39.408

10k+ parts

-

2,111

$43.786

$4,066.215

$39.408

-

DigiPath Technology Company

USA . 1,924 parts In-Stock

1+ parts

$48.214

100+ parts

$44.357

1k+ parts

-

10k+ parts

-

1,924

$48.214

$44.357

-

-

ChromeModa Solutions

Germany . 2,283 parts In-Stock

1+ parts

$49.198

100+ parts

$40.342

1k+ parts

-

10k+ parts

-

2,283

$49.198

$40.342

-

-

IDEA Electronic Components Group

UK . 1,424 parts In-Stock

1+ parts

$49.198

100+ parts

$46.738

1k+ parts

$44.278

10k+ parts

-

1,424

$49.198

$46.738

$44.278

-

Overview

Experience unparalleled performance and reliability with the MSP430F5131IRSBT by Texas Instruments, a leading manufacturer in the microcontroller industry. Ideal for a wide range of applications, this chip carrier microcontroller offers advanced features like BOR, CRC, DMA, and more. With a maximum clock frequency of 25 MHz and low power mode, it provides efficient operation while consuming minimal energy. Trust in Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Unlock the potential of your projects with the MSP430F5131IRSBT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the microcontroller onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power requirements in different applications.

CPU Family: MSP430

Part of the MSP430 family known for its low power consumption and high performance, making it ideal for battery-powered devices and IoT applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors, enabling the measurement of real-world signals.

DMA Channels: YES

DMA channels enable direct memory access, improving data transfer efficiency and freeing up the CPU to perform other tasks.

ROM Words: 8192

Large ROM capacity allows for storing program instructions and data, enabling complex applications to be run on the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Using RISC architecture enhances the performance of the microcontroller by simplifying instruction execution and reducing power consumption.

Technical Specifications

Microcontrollers MSP430F5131IRSBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of I/O Lines:

31

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

25 rpm

Maximum Supply Current:

6.15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), POR, PWM, TIMER(2), WDT

Trade Compliance

MSP430F5131IRSBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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