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MSP430F479IZQWR

Texas Instruments

MSP430F479IZQWR by Texas Instruments

MSP430F479IZQWR by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 2/3.3V power supplies, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, LCD, and UART for connectivity via I2C and SPI interfaces. Operating temperature ranges from -40 to 85°C.

Median Price

$5.850

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$5.850

1k+ parts

$5.240

10k+ parts

$4.930

2

-

$5.850

$5.240

$4.930

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,607 parts In-Stock

1+ parts

$6.175

100+ parts

-

1k+ parts

-

10k+ parts

-

1,607

$6.175

-

-

-

Vyrian

USA . 9,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 107 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$5.850

-

-

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AZTECH Wire

Italy . 133 parts In-Stock

1+ parts

$14.340

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$14.340

-

-

-

Parana Technologies

USA . 581 parts In-Stock

1+ parts

$37.881

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$37.881

-

-

-

DigiPath Technology Company

USA . 1,193 parts In-Stock

1+ parts

$41.712

100+ parts

$38.375

1k+ parts

-

10k+ parts

-

1,193

$41.712

$38.375

-

-

ChromeModa Solutions

Germany . 3,610 parts In-Stock

1+ parts

$42.563

100+ parts

$34.902

1k+ parts

-

10k+ parts

-

3,610

$42.563

$34.902

-

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$42.563

100+ parts

$40.435

1k+ parts

$38.307

10k+ parts

-

1,289

$42.563

$40.435

$38.307

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,000

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-

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Perfect Parts

USA . 1,205 parts In-Stock

1+ parts

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1,205

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Microchip USA

USA . 359 parts In-Stock

1+ parts

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100+ parts

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359

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F479IZQWR microcontroller. Known for its quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Perfect for a wide range of applications, this microcontroller offers unmatched performance and efficiency. Experience seamless connectivity and advanced features while enjoying the benefits of low power consumption and high-speed processing. Elevate your projects with the MSP430F479IZQWR and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides durability and protection to the internal components.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

No. of Terminals: 113

Having a higher number of terminals provides more connectivity options and flexibility in designing complex systems.

ADC Channels: YES

Having analog to digital converter channels allows for interfacing with analog sensors and inputs, enabling a wider range of applications.

Maximum Clock Frequency: 8 MHz

A higher clock frequency allows for faster processing speeds and real-time applications, making the microcontroller suitable for high-performance tasks.

ROM Programmability: FLASH

Using flash memory for ROM programmability allows for easy reprogramming of the microcontroller, making it versatile for different applications.

Technical Specifications

Microcontrollers MSP430F479IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, LCD, RTC, TIMER(7), WDT"

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F479IZQWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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