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MSP430F4793IPZR

Texas Instruments

MSP430F4793IPZR by Texas Instruments

MSP430F4793IPZR by Texas Instruments is a 16-bit microcontroller with 10-Ch 10-Bit ADC channels, 2560 RAM bytes, and 61440 ROM words. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, Comparator, LCD, and Timer(7) with connectivity options such as I2C(2), SPI(4), and UART(2).

Median Price

$9.168

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 15,536 parts In-Stock

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$7.816

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$6.372

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$4.248

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Mouser Electronics

USA . 860 parts In-Stock

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$10.520

100+ parts

$8.790

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$6.580

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860

$10.520

$8.790

$6.580

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Distributors (In-Stock)

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Nova Conductors

Japan . 71 parts In-Stock

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$5.278

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$5.278

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Maritex

Poland . 780 parts In-Stock

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$6.729

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$4.223

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$3.430

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780

$6.729

$4.223

$3.430

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Digiode

USA . 665 parts In-Stock

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$7.425

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Vyrian

USA . 7,838 parts In-Stock

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Sensible Micro Corp

USA . 4,000 parts In-Stock

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HZD GmbH

Germany . 640 parts In-Stock

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640

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LWI Electronics Inc

India . 15 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 647 parts In-Stock

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$5.278

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$5.173

647

$5.278

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$5.173

Netroflash

USA . 100 parts In-Stock

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$5.278

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$5.173

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100

$5.278

$5.173

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Ampacity Inc.

Singapore . 8,090 parts In-Stock

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$6.640

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Corphita

USA . 4,303 parts In-Stock

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$7.034

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Component Stockers USA

USA . 25,174 parts In-Stock

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$9.850

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$7.370

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$4.510

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$4.510

25,174

$9.850

$7.370

$4.510

$4.510

Parana Technologies

USA . 2,287 parts In-Stock

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$34.804

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ChromeModa Solutions

Germany . 5,532 parts In-Stock

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$39.106

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$32.067

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$32.067

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IDEA Electronic Components Group

UK . 2,111 parts In-Stock

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$39.106

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$37.151

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$35.195

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$35.195

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Kepictronics

USA . 30,000 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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S.R.D Solutions

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DigiPath Technology Company

USA . 1,161 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 830 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 501 parts In-Stock

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iodParts Technologies Inc.

India . 124 parts In-Stock

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$5.913

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Overview

Discover the powerful MSP430F4793IPZR microcontroller by Texas Instruments, a cutting-edge solution for a wide range of applications. With advanced technology and top-notch quality, this microcontroller offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile device provides exceptional value and efficiency, making it the perfect choice for your next project. Elevate your designs with the MSP430F4793IPZR and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost-effectiveness and durability for the product.

Integrated Cache: YES

The integrated cache helps in improving the overall performance and efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexible power supply options and compatibility with various systems.

Package Shape: SQUARE

The square shape offers efficient use of space and makes it easier for mounting and integration in devices.

Bit Size: 16

The 16-bit architecture provides enhanced processing capabilities compared to lower bit sizes.

No. of Terminals: 100

Sufficient number of terminals for connectivity and expansion options.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature conditions as well.

ADC Channels: YES

Analog-to-Digital Converter channels allow for easy interfacing with analog sensors and devices.

ROM Words: 61440

Large memory capacity for program storage and data handling.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Analog To Digital Convertors: 10-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

No. of Serial I/Os: 2

Sufficient serial communication interfaces for connecting with external devices.

PWM Channels: YES

Pulse-Width Modulation channels enable precise control of analog output signals.

Technical Specifications

Microcontrollers MSP430F4793IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3 V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2560

RAM Words:

2.5

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, LCD, TIMER(7), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430F4793IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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