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MSP430F4783IPZ

Texas Instruments

MSP430F4783IPZ by Texas Instruments

MSP430F4783IPZ by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 10-Ch 10-Bit ADC channels, and 7 timers. It operates at a max clock frequency of 16 MHz and features low power mode for industrial applications. The package style is flatpack with a terminal pitch of 0.5 mm, making it suitable for various connectivity options like I2C, SPI, and UART.

Median Price

$6.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,103 parts In-Stock

1+ parts

$7.526

100+ parts

$6.135

1k+ parts

$4.090

10k+ parts

-

10,103

$7.526

$6.135

$4.090

-

Chip1Stop

Japan . 450 parts In-Stock

1+ parts

-

100+ parts

$4.775

1k+ parts

-

10k+ parts

-

450

-

$4.775

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$7.150

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$7.150

-

-

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Vyrian

USA . 3,918 parts In-Stock

1+ parts

-

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-

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10k+ parts

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3,918

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,800 parts In-Stock

1+ parts

$6.773

100+ parts

-

1k+ parts

-

10k+ parts

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2,800

$6.773

-

-

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AZTECH Wire

Italy . 689 parts In-Stock

1+ parts

$18.440

100+ parts

-

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10k+ parts

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689

$18.440

-

-

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Parana Technologies

USA . 2,124 parts In-Stock

1+ parts

$43.147

100+ parts

-

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10k+ parts

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2,124

$43.147

-

-

-

DigiPath Technology Company

USA . 159 parts In-Stock

1+ parts

$47.510

100+ parts

$43.710

1k+ parts

-

10k+ parts

-

159

$47.510

$43.710

-

-

IDEA Electronic Components Group

UK . 1,093 parts In-Stock

1+ parts

$48.480

100+ parts

$46.056

1k+ parts

$43.632

10k+ parts

-

1,093

$48.480

$46.056

$43.632

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ChromeModa Solutions

Germany . 1,009 parts In-Stock

1+ parts

$48.480

100+ parts

$39.754

1k+ parts

-

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1,009

$48.480

$39.754

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QUARKTWIN TECHNOLOGY LTD

USA . 17,494 parts In-Stock

1+ parts

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17,494

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Lixinc

USA . 648 parts In-Stock

1+ parts

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10k+ parts

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648

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Overview

Experience the power and versatility of the MSP430F4783IPZ microcontroller from Texas Instruments. Built with top-notch quality and precision, this device is perfect for a wide range of applications in various industries. With advanced features such as integrated cache and low power mode, this microcontroller offers unparalleled performance and efficiency. Trust in Texas Instruments' reputation for excellence and innovation to deliver reliable solutions for your projects. Upgrade to the MSP430F4783IPZ and unlock a world of possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, the microcontroller can handle a wider range of power inputs.

Package Shape: SQUARE

The square shape allows for efficient layout on circuit boards, optimizing space usage.

Power Supplies (V): 2/3.3

Offering multiple power supply options gives flexibility in design and compatibility with various systems.

ADC Channels: YES

Having analog to digital convertors enables the microcontroller to interface with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient execution of instructions and faster processing speed.

ROM Programmability: FLASH

Flash programmable ROM allows for easy reprogramming of the microcontroller without the need for external equipment.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(4), UART(2), USCI(4)

Multiple connectivity options make the microcontroller versatile and suitable for various communication protocols.

Technical Specifications

Microcontrollers MSP430F4783IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3 V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, LCD, TIMER(7), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430F4783IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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