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MSP430F47187IPZ

Texas Instruments

MSP430F47187IPZ by Texas Instruments

MSP430F47187IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 118784 ROM words, and 7 ADC channels. Ideal for industrial applications requiring low power consumption, it features 7 timers, PWM channels, and various connectivity options like I2C and SPI.

Median Price

$21.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 870 parts In-Stock

1+ parts

$14.891

100+ parts

$12.140

1k+ parts

$8.093

10k+ parts

-

870

$14.891

$12.140

$8.093

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DigiKey

USA . 175 parts In-Stock

1+ parts

$21.740

100+ parts

$15.197

1k+ parts

-

10k+ parts

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175

$21.740

$15.197

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-

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$21.740

100+ parts

$15.190

1k+ parts

$14.950

10k+ parts

-

120

$21.740

$15.190

$14.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,853 parts In-Stock

1+ parts

$14.146

100+ parts

-

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4,853

$14.146

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Chip Stock

USA . 11,500 parts In-Stock

1+ parts

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11,500

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Vyrian

USA . 4,192 parts In-Stock

1+ parts

-

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4,192

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LWI Electronics Inc

India . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,298 parts In-Stock

1+ parts

$13.402

100+ parts

-

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2,298

$13.402

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Parana Technologies

USA . 446 parts In-Stock

1+ parts

$34.132

100+ parts

-

1k+ parts

$143.103

10k+ parts

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446

$34.132

-

$143.103

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Microchip USA

USA . 1,284 parts In-Stock

1+ parts

$37.310

100+ parts

$36.770

1k+ parts

$36.510

10k+ parts

$36.240

1,284

$37.310

$36.770

$36.510

$36.240

DigiPath Technology Company

USA . 35 parts In-Stock

1+ parts

$37.584

100+ parts

-

1k+ parts

-

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35

$37.584

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ChromeModa Solutions

Germany . 5,591 parts In-Stock

1+ parts

$38.351

100+ parts

$31.448

1k+ parts

-

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5,591

$38.351

$31.448

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

1+ parts

$38.351

100+ parts

$36.433

1k+ parts

$34.516

10k+ parts

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1,182

$38.351

$36.433

$34.516

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Lixinc

USA . 12,493 parts In-Stock

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12,493

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Perfect Parts

USA . 105 parts In-Stock

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105

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Kepictronics

USA . 82 parts In-Stock

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82

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Overview

Unleash the potential of your next project with the Texas Instruments MSP430F47187IPZ microcontroller. Built to deliver exceptional performance and reliability, this device offers a wide range of applications in various industries. From its low power consumption to its advanced peripherals, this microcontroller provides unmatched value and benefits to customers looking to push the boundaries of their designs. Trust in the quality and expertise of Texas Instruments to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material allows for a lightweight and durable package, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements efficiently.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width enables efficient processing and storage of data on the chip.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance and efficient processing capabilities for a wide range of applications.

Maximum Clock Frequency: 16 MHz

A higher clock frequency allows for faster processing speeds, making the microcontroller suitable for tasks that require quick responses.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, making the microcontroller versatile for interfacing with various sensors and inputs.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption, which is essential for battery-operated or energy-efficient devices.

Technical Specifications

Microcontrollers MSP430F47187IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

68

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

MSP430F47187IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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